Circuit board inner groove machining method

Abstract

The invention discloses a circuit board inner groove machining method. The circuit board inner groove machining method comprises the following steps of providing a substrate, wherein the substrate comprises a base material and a metal layer covering the base material; forming an open window matched with the shape of the inner groove in the metal layer; cutting the base material by a laser beam along the edge of the open window; and enabling the cut base material to be separated from the base plate to form the inner groove. According to the circuit board inner groove machining method, the base material is continuously burnt and etched by a thermal effect of laser so as to fulfill the purpose of cutting; the metal layer is relatively low in laser absorption efficiency and relatively high in melting point, and the required destroy energy is relatively high, so that the metal layer is hard to machine by laser; therefore, the open window is formed in the metal layer before performing laser cutting, so that laser only acts on the base material; the laser beam cuts the base material along the edge of the open window, and point machining is converted into continuous processing, so that the circular bead machining limitation for an ultra-small circular bead inner groove is eliminated; and meanwhile, the machining efficiency and the machining precision are effectively improved.

Description

technical field [0001] The invention relates to the technical field of circuit board manufacturing, in particular to a method for processing inner grooves of a circuit board. Background technique [0002] With the development of electronic products in the direction of thinner and smaller, the requirements for the integration of circuit boards as carriers of electronic products are also getting higher and higher. In order to realize the miniaturization of the overall assembly volume of some products, different types of inner grooves are designed on the circuit board, which facilitates the installation of components and reduces the installation space. It includes a design of an ultra-small rounded inner groove. The main feature of the rounded inner groove is that the corners are rounded, the radius of the rounded corner is R≤0.30mm, and the length and width of the groove are ≤2.0mm. [0003] For the production of the above ultra-small rounded inner grooves, the conventional p...

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Problems solved by technology

However, this processing method is limited by the milling cutter used for processing. The diameter of the conventional milling cutter is ≥0.5mm, and the customized milling cutter can achieve a diameter of 0.3mm, but the cost is high, and it cannot meet the inner radius of the fillet R≤0.15mm. Grooving

[0005] The above two processing methods have deficiencies in processing cost, processing efficiency, processing quality and processing capacity.

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