Packaging structure of light-emitting diode

A technology of light-emitting diodes and packaging structures, which is applied to electrical components, electrical solid devices, circuits, etc., and can solve problems such as weak mechanical strength and easy breakage
CN105591007AActive Publication Date: 2016-05-18ZHANJING TECH SHENZHEN +1
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
ZHANJING TECH SHENZHEN
Publication Date
2016-05-18

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Abstract

The invention relates to a packaging structure of a light-emitting diode. The packaging structure comprises at least two electrodes, at least one light-emitting diode chip connected with the at least two electrodes electrically, a packaging body covering the light-emitting diode chip, and a housing encircling the packaging body and the light-emitting diode chip. The housing includes a pedestal and a reflection cup extending upwardly from the pedestal; and the light-emitting diode chip is encircled by the reflection cup. Besides, the housing also includes a supporting element that is arranged inside the reflection cup and stretches across the at least two electrodes.
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Description

technical field

[0001] The invention relates to a semiconductor element, in particular to a light emitting diode packaging structure. Background technique

[0002] Compared with traditional light sources, Light Emitting Diode (LED) has the advantages of light weight, small size, low pollution, long life, etc. As a new type of light source, it has been increasingly used in various fields Among them, such as street lights, traffic lights, signal lights, spotlights and decorative lights.

[0003] Existing LED packaging structures generally include electrodes, LED chips electrically connected to the electrodes, a packaging body covering the LED chips on a substrate, and a casing surrounding the aforementioned structure and playing a supporting role. However, in the prior art, in order to meet the miniaturization and thinning design requirements of the semiconductor element, the shell of the light emitting diode packaging structure is usually designed to be thinner, resulting in...

Claims

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