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Loudspeaker module and manufacturing method of same

A loudspeaker module and loudspeaker technology are applied in the manufacture of loudspeaker module casings and the field of loudspeaker module casings, which can solve the problems of reduction of the effective area of ​​the diaphragm, consistency, reduction of the speaker yield and the controllable rate of production, etc. , to achieve the effect of ensuring effective area, improving yield and tight connection

Active Publication Date: 2016-05-18
GOERTEK INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The problem with this sealing method is that the effective area of ​​the diaphragm is reduced because the bonding fluid is easy to flow and overflow to the diaphragm of the speaker unit after being pressurized, so that the effective area of ​​the diaphragm does not match the design area. Affects the acoustic performance of the loudspeaker
Moreover, the thickness of the glue layer in this sealing method cannot be consistent everywhere, resulting in a decrease in the yield rate of the speaker and the controllable rate of production.

Method used

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  • Loudspeaker module and manufacturing method of same
  • Loudspeaker module and manufacturing method of same
  • Loudspeaker module and manufacturing method of same

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Embodiment approach

[0047] The present invention also provides a method for manufacturing a loudspeaker module, so as to achieve a better combination between the intermediate connector 3 and the loudspeaker module housing 1, Figure 5 An embodiment of the manufacturing method is shown, which specifically includes the following steps:

[0048] 1) A recess 121 and an intermediate connector platform 122 located at the bottom of the recess 121 are formed on the lower shell 12 of the speaker module housing 1 by a one-time molding process;

[0049] 2) The intermediate connector 3 is formed on the intermediate connector platform 122 in step 1) using a secondary injection molding process. The adoption of the secondary injection molding process can not only ensure the reliability of the connection between the intermediate connector 3 and the intermediate connector platform 122 It can also realize fully automatic production, which is conducive to improving production efficiency and saving human resources; ...

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Abstract

The invention discloses a loudspeaker module and a manufacturing method of the same. The loudspeaker module comprises a loudspeaker module shell and a loudspeaker module monomer, the loudspeaker module shell comprises an upper shell and a lower shell and further comprises a middle connection piece, lower shell is provided with a concave portion, the bottom end of the concave portion is provided with a middle connection piece platform, the middle connection piece is fixedly connected with the middle connection piece platform, and middle connection piece is located between the middle connection piece and the loudspeaker monomer. According to the loudspeaker module and the manufacturing method of the same, the middle connection piece is independently arranged between the lower shell and the loudspeaker monomer, and the problem of flowing liquid overflowing does not exist for the middle connection piece, so that interference with a vibration membrane of the loudspeaker monomer cannot occur, and the effective area of the vibration membrane and the acoustic performance of the loudspeaker can be effectively guaranteed; the thickness of the middle connection piece is controllable, and it is beneficial to improve the yield of the loudspeaker and the controllable rate of production.

Description

technical field [0001] The present invention relates to the technical field of electroacoustic products, and more particularly, to a speaker module casing and a manufacturing method for the speaker module casing. Background technique [0002] Loudspeakers are widely used in people's daily production and life as a sound-generating device for electronic products such as mobile phones, televisions, and computers. At present, the common speakers mainly include dynamic speakers, electromagnetic speakers, capacitive speakers, piezoelectric speakers, etc. Among them, the dynamic speakers have the characteristics of relatively simple production, low cost, and good low-frequency sound advantages. be widely applied. [0003] Existing dynamic speakers are also called dynamic speaker modules, which generally include a speaker module housing and a speaker unit, wherein the speaker module housing includes an upper shell and a lower shell, and the upper shell and the lower shell cooperate...

Claims

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Application Information

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IPC IPC(8): H04R9/06H04R9/02H04R31/00
CPCH04R9/02H04R9/06H04R31/00H04R2231/001
Inventor 郝正恩周树芝
Owner GOERTEK INC
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