Automatic exposure machine mechanism

Abstract

The invention discloses an automatic exposure machine mechanism, which comprises a frame, a lower frame lifting mechanism, a frame change mechanism and a lifting alignment device, wherein the frame is used for clamping a negative film and a substrate in the up-down direction; the frame is divided into a lower frame and an upper frame, which are arranged at the left side and the right side; the lower frame lifting mechanism is arranged at the bottom end of the lower frame and is used for controlling lifting of the lower frame to the same height as the upper frame; the frame change mechanism is used for exchanging the positions of the upper frame and the lower frame in the left-right direction; and the lifting alignment device is arranged below the lower frame and is used for adjusting the position, relative to the upper negative film, of the lower substrate. The automatic exposure machine mechanism is simple in structure, good in stability and high in exposure accuracy. The lower frame is provided with the lower frame lifting mechanism, so that the condition that an industrial camera does not generate an error due to a focusing problem of the lower stage frame when collecting an image is ensured; the lifting alignment device can adjust the position, relative to the negative film, of the lower substrate, so that accurate alignment is achieved; the upper frame and the lower frame are subjected to left and right position exchange through the frame change mechanism; the automatic exposure machine mechanism is simple to run and convenient to operate; an exposure machine can stably run; and the work efficiency is also improved.

Description

technical field [0001] The invention is applied to the field of exposure process equipment in the printed circuit board industry, and more specifically relates to an automatic exposure machine mechanism. Background technique [0002] In the exposure process of printed circuit boards, the circuit images on the film are transferred to the substrate. Pad printing is to irradiate an ultraviolet-sensitive material with ultraviolet rays to make the material undergo chemical changes, so that the material is divided into two states after ultraviolet irradiation, and the circuit image pad printing is completed. A very important issue in image pad printing is how to quickly and accurately align the negative with the target on the substrate. [0003] Most of the existing exposure machine mechanisms use industrial cameras to collect images of the film and the substrate, and then compare the position deviation of the two images, and move the position of the substrate back and forth to r...

AI Technical Summary

Problems solved by technology

However, due to the height difference between the upper and lower frames used to place the film and the substrate at the same time on the existing double-station exposure machine, there will be a problem of inconsistency in focus when using an industrial camera to collect images. The focusing process is not only time-consuming, but also prone to error

For the exposure machine, the exposure accuracy requirements are very high, and any error may cause the failure of image pad printing

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