Sub-pin organization

Abstract

The invention discloses a PIN separating mechanism. The PIN separating mechanism comprises a base, a power plant, a moving mechanism, a clamp structure, an elastic element and a limiting structure, wherein the moving mechanism comprises a first sliding block and a second sliding block; the clamp structure comprises multiple clamps capable of clamping PINs arranged side by side, including a first clamp, a second clamp, a third clamp and a fourth clamp in sequence; the elastic element comprises a first elastic element and a second elastic element for enabling the adjacent two clamps on the first sliding block and the second sliding block to generate relative distances respectively; the limiting structure comprises a first limiting structure and a second limiting structure for limiting predetermined displacements between the adjacent two clamps on the first sliding block and the second sliding block respectively; a first connecting part drives the first sliding block to slide close to or far from the second sliding block under the drive of the power plant; when the first sliding block is tightly adhered to the second sliding blocks, the clamps are gathered together; and when the first sliding block performs the predetermined displacement in a direction far from the second sliding block, the clamps are separated. The PIN separating mechanism is high in efficiency, low in error, and capable of realizing automatic preparation process for electronic parts and components.

Description

technical field [0001] The invention relates to the technical field of electronic component processing equipment, in particular to a PIN distribution mechanism. Background technique [0002] Electronic components, especially various electronic connectors, are usually formed by assembling an insulating base and a plurality of metal PIN pins. The assembly method of the PIN pin and the insulating base is generally plug-in or injection molding. The insertion refers to inserting the PIN needle into the preset hole of the insulating base; the injection molding refers to putting the PIN needle into the mold and directly injection molding the insulating base seamlessly fixed with the PIN needle . [0003] When the PIN needle is processed, the conductive metal material is usually first cut into a strip structure, and then the required PIN needle structure is punched out in a punching machine. For the convenience of transportation and subsequent production, some residual material i...

AI Technical Summary

Problems solved by technology

[0005] Therefore, the technical problem to be solved in the present invention is to overcome the adjustment of the PIN needle spacing in the prior art is to realize manually, the defect of low production efficiency and high error rate, thereby providing a kind of PIN distribution system with high production efficiency and low error rate. mechanism

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