Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Flexible printed circuit board and mobile terminal

A technology for flexible circuit boards and mobile terminals, which is applied to printed circuits, printed circuits, printed circuit components, etc., and can solve the problem of messy layout of signal lines, low flexibility of bending parts of flexible circuit boards, and affecting the use of flexible circuit boards, etc. problem, to achieve the effect of improving flexibility

Active Publication Date: 2016-06-01
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
View PDF5 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the application of flexible circuit boards is more and more extensive, so the requirements for the flexibility of flexible circuit boards are becoming more and more stringent. Copper foil, while the layout of signal lines is messy, so when there are ground layers and signal lines in the bending part of the flexible circuit board, due to the large internal stress of the ground layer and signal lines, the ground layer and signal lines increase The bending resistance of the flexible circuit board is not mentioned above, which leads to the low flexibility of the bending part of the flexible circuit board, which affects the use of the flexible circuit board

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Flexible printed circuit board and mobile terminal
  • Flexible printed circuit board and mobile terminal
  • Flexible printed circuit board and mobile terminal

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0023] see figure 1 with figure 2 , the present invention provides a mobile terminal of an embodiment, including a device body (not shown in the figure), a main board (not shown in the figure) disposed inside the device body, and a flexible circuit board 100, the flexible circuit board 100 is set It is inside the device body and is electrically connected to the main board.

[0024] The mobile terminal can be an intelligent mobile terminal such as a mobile p...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a flexible printed circuit board and a mobile terminal. The flexible printed circuit board comprises a substrate layer, a circuit layer and a covering film. The circuit layer is arranged on the substrate layer and comprises non-bending parts and a bending part. The bending part is provided with multiple signal wirings and multiple grounding wirings. The signal wirings are parallelly arranged. The length directions of the signal routing wires are parallel to the opposite direction of the non-bending parts. The grounding wirings are parallelly arranged. The lengths directions of the grounding wirings are perpendicular to the length directions of the signal wirings. The stress directions of the parallelly-arranged signal wirings are consistent with each other and are mutually dispersed, so bending resistance force imposed by each of the signal wirings on the bending part is reduced. There is no stress effect between the adjacent grounding wirings, so no bending resistance force is imposed on the bending part and flexibility of the flexible printed circuit board is improved.

Description

technical field [0001] The invention relates to the communication field, in particular to a flexible circuit board and a mobile terminal. Background technique [0002] At present, the application of flexible circuit boards is more and more extensive, so the flexibility requirements of flexible circuit boards are becoming more and more stringent. However, there are signal traces and ground layers in all flexible circuit boards. Usually, the ground layer is set on the entire large area. Copper foil, while the layout of the signal lines is messy, so when there are ground layers and signal lines in the bending part of the flexible circuit board, due to the large internal stress of the ground layer and signal lines, the ground layer and signal lines increase. The above-mentioned bending resistance of the flexible circuit board leads to low flexibility of the bending part of the flexible circuit board, thereby affecting the use of the flexible circuit board. Contents of the inve...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11
CPCH05K1/118H05K2201/09227
Inventor 苏章逢
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com