Rigid-flexible combined plate and method for plugging blind buried hole thereof

A rigid-flex board, blind and buried via technology, applied in the structural connection of printed circuits, printed circuit components, electrical components, etc., can solve problems such as increasing production costs, achieve high flatness, reduce production costs, and reduce board surface. High flatness effect

Active Publication Date: 2016-06-08
GUANGZHOU FASTPRINT CIRCUIT TECH +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method requires corresponding special equipment, and the remaining glue needs to be polished after processing, which undoubtedly increases the production cost for the enterprise.

Method used

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  • Rigid-flexible combined plate and method for plugging blind buried hole thereof
  • Rigid-flexible combined plate and method for plugging blind buried hole thereof

Examples

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Embodiment Construction

[0033] Embodiments of the present invention are described in detail below:

[0034] like figure 1 As shown, the rigid-flex board described in this embodiment includes a rigid sub-board 1 and a rigid-flex sub-board 2, the rigid sub-board 1 is fixed on the rigid-flex sub-board 2, and the rigid sub-board 1 and / or The rigid-flex sub-board 2 is provided with a blind buried hole, and at least one non-flowing prepreg 3 is arranged between the rigid sub-board 1 and the rigid-flexible sub-board 2 , and the blind buried hole passes through the flow of the non-flowing prepreg 3 Gum filling. The above-mentioned rigid-flex board realizes the filling of blind buried holes on the rigid-flex board by arranging at least one non-flowing prepreg 3 between the rigid sub-board 1 and the rigid-flex sub-board 2 , thus simplifying the resin plug holes. process, without special plugging equipment and resin, greatly reducing production costs. Moreover, the rigid-flex bonded board obtained by pressin...

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PUM

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Abstract

The invention discloses a rigid-flexible combined plate and a method for plugging a blind buried hole thereof. The rigid-flexible combined plate comprises a rigid sub-plate and a rigid-flexible sub-plate, wherein the rigid sub-plate is fixedly arranged on the rigid-flexible sub-plate; the blind buried hole is formed on the rigid sub-plate and / or the rigid-flexible sub-plate; at least one non-flowing type prepreg is arranged between the rigid sub-plate and the rigid-flexible sub-plate; the blind buried hole is filled with the flowing glue of the non-flowing type prepreg. The method for plugging the blind buried hole of the rigid-flexible combined plate comprises the following steps: supplying the rigid sub-plate and the rigid-flexible sub-plate; forming the blind buried hole on the rigid sub-plate and / or the rigid-flexible sub-plate; performing metallizing treatment on the blind buried hole; stacking at least one non-flowing type prepreg between the rigid sub-plate and the rigid-flexible sub-plate; pressing the rigid sub-plate and the rigid-flexible sub-plate and pressing the flowing glue of the non-flowing type prepreg into the blind buried hole. According to the rigid-flexible combined plate and the method for plugging the blind buried hole thereof, the processing is convenient, the smoothness of the plate is excellent, the special device is saved and the production cost is lowered.

Description

technical field [0001] The invention relates to the technical field of circuit board printing, in particular to a rigid-flexible board and a blind-buried hole plugging method thereof. Background technique [0002] With the development of electronic products in the direction of miniaturization and portability, the required printed circuit boards are also developing in the direction of lightness, thinness, shortness and smallness. Among them, the high-density interconnection (HDI) rigid-flex board with high-density wiring, contacts and capable of three-dimensional assembly is a product in line with this development direction. [0003] Due to the multi-layer and densification requirements of circuit boards, blind buried holes appear more and more frequently in circuit board structures. Rigid-flex boards have a variety of materials and changeable media, which further complicates their blind and buried hole processing technology. During the process of circuit board processing, ...

Claims

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Application Information

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IPC IPC(8): H05K1/14H05K3/00
CPCH05K1/147H05K3/0094H05K2201/0959
Inventor 易小龙林楚涛陈蓓
Owner GUANGZHOU FASTPRINT CIRCUIT TECH
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