A method of processing a hole-opening head
A processing method and head technology, which is applied in the processing field of perforated heads, can solve problems such as low processing accuracy, decreased wafer strength, and product scrapping, and achieve the effects of simple operation, high processing efficiency, and good product quality
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment
[0033] Please refer to Figure 1-Figure 4 As shown, the present invention will be further described below with regard to the processing method of the head shown in the figure.
[0034] Processing the perforated head includes the following steps:
[0035] S10: Material selection. In this embodiment, a stainless steel plate with the brand name 06Cr18Ni11Ti is selected. This stainless steel plate has good wear resistance and can effectively prevent block solids from abrading the head during the working process of the stirring equipment or sewage treatment equipment.
[0036] S20: Draw a line, draw a circle on the plate according to the size requirements of the design, as the basis for the blanking size.
[0037] S30: blanking, cutting the plate to form a disc.
[0038] S40: Drilling, fixing a point on the wafer, opening a through hole on the CNC machine tool to form an orifice plate 1. In this embodiment, the CNC machine tool selects a CNC drilling machine.
[0039] S50: Stamp...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 


