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Surface copper electroplating liquid of magnesium alloy intelligent mobile phone shell

A smart phone, magnesium alloy technology, applied in the field of electroplating, to achieve the effect of reduced drop-off probability, good bonding force, and excellent corrosion resistance

Active Publication Date: 2016-06-15
SHENZHEN XINHONGSHUN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The uniformity, flatness and bonding force with the metal substrate of the electroplating copper coating in the above-mentioned processes are not very ideal

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] A plating solution for electroplating copper on the surface of a magnesium alloy smart phone casing, the magnesium alloy is composed of the following components by mass percentage: 5% Al, 3.6% Cu, 0.1% Mn, 2.4% Zn, 0.2 % Ti, 1.8% Zr, 0.3% Ni, 0.3% V, the balance being Mg and unavoidable impurities, the plating solution includes two parts: pre-galvanized plating solution and electroplating copper plating solution: Among them, the composition of pre-galvanized dipping solution is: ZnSO 4 ·7H 2 O32g / L, K 4 P 2 o 7 ·3H 2 O168g / L, KF18g / L, C 6 h 17 o 7 N 3 36 g / L, Phytic acid 0.4g / L, H 2 CSNH 2 :6 g / L, the balance is water; the plating solution of described copper plating consists of: CuSO 4 40g / L, CuCl 2 14g / L, K 2 CO 3 55g / L, K 4 P 2 o 7 ·3H 2 O260g / L, C 4 h 4 o 6 KNa·3H 2 O44g / L, K 2 HPO 4 ·3H 2 O65g / L, 100g / L of hydroxyethylene disulfonic acid, 0.5g / L of phytic acid, and the balance is water.

Embodiment 2

[0020] A plating solution for electroplating copper on the surface of a magnesium alloy smart phone casing, the magnesium alloy is composed of the following components by mass percentage: 7% Al, 3.2% Cu, 0.3% Mn, 2% Zn, 0.3% % Ti, 1.6% Zr, 0.5% Ni, 0.1% V, and the balance is Mg and unavoidable impurities. The plating solution includes two parts: a pre-galvanized plating solution and an electroplated copper plating solution: Among them, the composition of pre-galvanized dipping solution is: ZnSO 4 ·7H 2 O36g / L, K 4 P 2 o 7 ·3H 2 O164g / L, KF20g / L, C 6 h 17 o 7 N 3 32g / L, phytic acid 0.6g / L, H 2 CSNH 2 : 4g / L, surplus is water; The plating solution of described copper plating consists of: CuSO 4 50g / L, CuCl 2 12g / L, K 2 CO 3 65g / L, K 4 P 2 o 7 ·3H 2 O240g / L, C 4 h 4 o 6 KNa·3H 2 O48g / L, K2 HPO 4 ·3H 2 O55g / L, hydroxyethylene disulfonic acid 110g / L, phytic acid 0.3g / L, and the balance is water.

Embodiment 3

[0022] A plating solution for electroplating copper on the surface of a magnesium alloy smart phone casing, the magnesium alloy is composed of the following components by mass percentage: 6% of Al, 3.4% of Cu, 0.2% of Mn, 2.2% of Zn, 0.25% % of Ti, 1.7% of Zr, 0.4% of Ni, 0.2% of V, and the balance is Mg and unavoidable impurities. The plating solution includes two parts: a pre-galvanized plating solution and an electroplated copper plating solution: The composition of the pre-galvanized dipping solution is: ZnSO 4 ·7H 2 O34g / L, K 4 P 2 o 7 ·3H 2 O166g / L, KF19g / L, C 6 h 17 o 7 N 3 34g / L, phytic acid 0.5g / L, H 2 CSNH 2 : 5g / L, surplus is water; The plating solution of described copper plating consists of: CuSO 4 45g / L, CuCl 2 13g / L, K 2 CO 3 60g / L, K 4 P 2 o 7 ·3H 2 O250g / L, C 4 h 4 o 6 KNa·3H 2 O46g / L, K 2 HPO 4 ·3H 2 O60g / L, 105g / L of hydroxyethylene disulfonic acid, 0.4g / L of phytic acid, and the balance is water.

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PUM

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Abstract

The invention discloses surface copper electroplating liquid of a magnesium alloy intelligent mobile phone shell. A magnesium alloy consists of the following components in percentage by mass: 5-7% of Al, 3.2-3.6% of Cu, 0.1-0.3% of Mn, 2-2.4% of Zn, 0.2-0.3% of Ti, 1.6-1.8% of Zr, 0.3-0.5% of Ni, 0.1-0.3% of V, and the balance of Mg and inevitable impurities. The plating liquid consists of two parts of zinc preplating liquid and copper electroplating liquid, wherein the zinc preplating liquid comprises 32-36 g / L of ZnSO4.7H2O, 164-168 g / L of K4P2O7.3H2O, 18-20 g / L of KF, 32-36 g / L of C6H1707N3, 0.4-0.6 g / L of phytic acid, 4-6 g / L of H2CSNH2, and the balance of water; and the copper plating liquid consists of 40-50 g / L of CuSO4, 12-14 g / L of Cl2, 55-65 g / L of K2CO3, 240-260 g / L of K4P2O7.3H2O, 44-48 g / L of C4H4O6KNa.3H2O, 55-65 g / L of K2HPO4.3H2O, 100-110 g / L of hydroxyl ethylidene, 0.3-0.5 g / L of phytic acid, and the balance of water.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to a plating solution for electroplating copper on the surface of a magnesium alloy smart phone casing. Background technique [0002] The heat dissipation of magnesium alloy is not only higher than that of plastic, but also better than that of aluminum alloy. The thermal diffusivity of magnesium alloy is 3.79×10 -5 m 2 Ps, the thermal diffusivity of aluminum alloy is 3.64×10 -5 m 2 Ps, while the thermal diffusivity of engineering plastics is 0. Magnesium alloys heat and dissipate heat faster than aluminum alloys, and engineering plastics are even more incomparable. Magnesium alloy also has a high performance of shielding electromagnetic interference, which is suitable for the casing of electronic equipment, especially for the casing of laptop computers, mobile phones, PDAs, digital cameras and other products. [0003] In short, magnesium alloy has the functions of light ...

Claims

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Application Information

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IPC IPC(8): C22C23/02C25D3/26C25D3/38C25D5/10
CPCC22C23/02C25D3/26C25D3/38C25D5/10
Inventor 张颖
Owner SHENZHEN XINHONGSHUN TECH CO LTD
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