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High frequency module and mobile terminal

A high-frequency module and port technology, which is applied to printed circuits, printed circuits connected with non-printed electrical components, electrical components, etc., can solve the problem of complicated wiring and structure of printed circuit boards, increased cost of high-frequency modules, increased Printed circuit board volume and other issues, to achieve the effect of simple structure and wiring scheme, and reduce production costs

Active Publication Date: 2018-12-11
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this solution often complicates the wiring and structure on the printed circuit board, increases the volume of the printed circuit board, and increases the cost of the high-frequency module

Method used

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  • High frequency module and mobile terminal
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  • High frequency module and mobile terminal

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Embodiment Construction

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0028] Please also refer to Figure 1 to Figure 3 , the embodiment of the present invention provides a high-frequency module, including a printed circuit board 1 , a matching element 3 and a chip 2 . Wherein: the printed circuit board 1 includes a first copper foil layer 11, a first dielectric layer 12, and a second copper foil layer 13 stacked in sequence, the first copper foil layer 11 is provided with a first hole 110, the The first dielectric layer 12 defines ...

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Abstract

The invention discloses a high-frequency model. The high-frequency model comprises a printed circuit board, a matching component and a chip, wherein the printed circuit board comprises a first copper foil layer, a first dielectric layer and a second copper foil layer which are sequentially laminated, a first hole is formed in the first copper foil layer, a second hole is formed in the first dielectric layer, the first hole and the second hole are communicated to jointly form an installation groove, the matching component is placed in the installation groove and comprises a first port, the chip is arranged on one side, far away from the first dielectric layer, of the first copper foil layer, and comprises a first interface, and the first interface is in contact connection with the first port. The high-frequency model disclosed by the invention is low in production cost. The invention also discloses a mobile terminal applying the high-frequency model.

Description

technical field [0001] The present invention relates to the technical field of high-frequency signal transmission, in particular to a high-frequency module and a mobile terminal using the high-frequency module. Background technique [0002] With the development of wireless communication technology, wireless network communication products are increasingly important. Generally, a high-frequency module in wireless communication includes a chip, an antenna, and a transmission wire connecting the chip and the antenna. When the transmission wire is formed on a printed circuit board (Printed Circuit Board, PCB), the routing scheme of the printed circuit board needs to meet impedance matching (impedance matching), so as to avoid reflection caused by impedance mismatch, The insertion loss during signal transmission is reduced, and the reduced return loss during signal transmission is relatively increased, so as to avoid affecting the quality of signal transmission. [0003] Impedan...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/18
CPCH05K1/183H05K2201/09036
Inventor 曾元清
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD