A preparation process of stacked hole laser HDI board

Abstract

The invention belongs to the field of circuit board processing, and particularly relates to a stacked via laser HDI board manufacturing process. Firstly, inner-layer patterning, inner-layer etching and browning are sequentially carried out on the second outermost layer of the HDI board; secondly, compression processing, laser positioning hole drilling, blind hole window patterning, blind hole window etching, laser drilling, outer-layer copper deposition, whole-board filled hole electroplating processing, outer-layer plated hole patterning, spot plating filled hole electroplating, film removal, abrasive belt board grinding, outer-layer hole drilling, outer-layer copper deposition, whole-board electroplating, outer-layer patterning, and pattern electroplating processing are carried out on all board layers of the HDI board; according to the laser hole drilling, hole drilling is carried out on the front surface and the back surface of the circuit board respectively, starting from the outermost layer, hole drilling passes through the second outermost layer and achieves at the third outermost layer. The process of the invention reduces the steps, reduces the cost, improves the production efficiency, fully improves the copper foaming problem, and has great market prospects and economic values.

Description

technical field [0001] The invention belongs to the field of circuit board processing, and in particular relates to a preparation process of a laser HDI board with stacked holes. Background technique [0002] At present, in the field of circuit boards, the traditional preparation method of stacked hole laser HDI usually needs to go through material cutting, inner layer patterning, inner layer etching, inner layer AOI, browning, L2-7 layer lamination, browning, laser drilling, etc. Hole, slice analysis, debrowning, inner layer copper sinking, full board hole filling plating, slice analysis, inner layer graphics, inner layer etching, inner layer AOI, browning, L1 / 8 layer lamination, browning, laser drilling Hole, slice analysis, browning, outer layer copper plating, whole board hole filling plating, slice analysis, copper reduction, outer layer drilling, outer layer copper sinking, full board plating, outer layer graphics, graphic plating, outer layer AOI , post-processing, e...

AI Technical Summary

Problems solved by technology

[0003] For this reason, the technical problem to be solved by the present invention is to overcome the complex manufacturing process of stacked hole laser HDI in the prior art, high cost and low production efficiency; and the technical bottleneck that the copper skin is easy to foam, thereby proposing a solution The manufacturing process of stacked hole laser HDI board that eliminates the bubble problem, reduces the process, reduces the cost, and improves the production efficiency