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A method for testing the thermal performance of t-components

A thermal performance and component technology, applied in the direction of instruments, calculations, electrical digital data processing, etc., can solve the problems of large determination error of the heat transfer coefficient of the shell surface of the T component, and the inability to accurately detect the thermal performance of the T component. Improved effect

Active Publication Date: 2018-11-16
青岛君戎华讯太赫兹科技有限公司
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0006] The purpose of the present invention is to provide a method and device for detecting the thermal performance of the T assembly to solve the problem that the determination error of the surface heat transfer coefficient of the T assembly shell in the prior art is relatively large, making it impossible to accurately detect the technology of the thermal performance of the T assembly question

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  • A method for testing the thermal performance of t-components
  • A method for testing the thermal performance of t-components
  • A method for testing the thermal performance of t-components

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Experimental program
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Embodiment 1

[0070] The object of embodiment 1 analysis is the T assembly of natural heat dissipation, and the concrete steps that adopt are as follows:

[0071] Step 101, determining the surface heat transfer coefficient of the shell of the T assembly;

[0072] Specifically, first determine an initial value of 8W / m for the surface heat transfer coefficient of the T component shell 2 ·k, using ANSYS to analyze the temperature distribution of the T component and the heat flux on the surface of the shell. According to the heat flux on the surface of the T component shell obtained from the ANSYS analysis, the surface heat transfer coefficient of the shell is manually calculated through the natural convection characteristic number correlation. Next, set the initial value 8W / m 2 Comparing k with the surface heat transfer coefficient calculated manually, if the error is within the acceptable range, then determine the surface heat transfer coefficient as the calculated surface heat transfer coef...

Embodiment 2

[0078] The object that embodiment 2 detects is the T assembly after adding the copper cold plate, and the concrete steps that adopt are as follows:

[0079] Step 101, determining the surface heat transfer coefficient of the T component shell after adding the copper cold plate;

[0080] Specifically, first determine an initial value of 8W / m for the surface heat transfer coefficient of the T component shell after adding the copper cold plate 2 k, using ANSYS software to analyze the temperature distribution of the T component after adding the copper cold plate and the heat flux density on the shell surface, according to the ANSYS analysis, the heat flux density on the shell surface of the T component after adding the copper cold plate is obtained, and then through the natural convection characteristics The surface heat transfer coefficient of the shell is calculated manually using numerical correlation. Next, set the initial value 8W / m 2 Comparing k with the surface heat transf...

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Abstract

The invention discloses a method and apparatus for detecting the heat performance of a T component. The method comprises the following steps of step 101, determining a surface heat transfer coefficient of a T component housing; and step 102, simulating a temperature distribution condition of the T component during working in ANSYS software. According to the method and apparatus, the reasonable surface heat transfer coefficient of the T component housing is determined with an approximation method and then the temperature distribution condition of the T component during working is simulated in the ANSYS software; and the method can effectively, simply and conveniently analyze temperature distribution of the T component in different heat dissipation modes, thereby improving the heat performance of the T component in a reasonable mode.

Description

technical field [0001] The invention belongs to the technical field of thermal analysis of electronic devices, in particular to a method for detecting the thermal performance of a T component. Background technique [0002] In recent years, with the advancement of science and technology and the development of electronic countermeasures technology, national defense, satellite communications and mobile communications have higher and higher requirements for phased array antennas, which also corresponds to single-type components used in phased array antennas. That is, the T component puts forward higher requirements. During the working process of the phased array antenna, the T component will generate a lot of heat, which will increase the temperature of the T component, thereby greatly reducing the performance of the T component. Do what-if analysis. [0003] ANSYS software based on finite element method provides a good thermal analysis platform for designers. The basic princ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F17/50
CPCG06F30/367
Inventor 冯军正吴光胜丁庆张齐军黄永江李晓丛王佳佳
Owner 青岛君戎华讯太赫兹科技有限公司