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Hardware injection molded switch preparation method

A hardware and switch technology, which is applied in the field of switch preparation, can solve problems such as terminal deformation, quality problems, and time-consuming process of electroplated parts, and achieve the effects of overcoming the influence of switch terminals, saving manpower and cost, and improving product yield.

Inactive Publication Date: 2016-07-13
COMAX ELECTRONICS HUL ZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Metal injection switches are currently molded and injected with a single piece of hardware, and then divided into individual parts for barrel plating. This process is time-consuming, and it is easy to deform the terminals of the electroplated parts, and it is also easy to cause foreign matter to adhere to the metal contact parts of the product due to friction and cause quality problems. question

Method used

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  • Hardware injection molded switch preparation method
  • Hardware injection molded switch preparation method

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Embodiment 1

[0034] Such as figure 1 Shown, a kind of preparation method of metal injection switch, comprises the following steps:

[0035] S1. Continuous stamping and forming of the metal strip by using a continuous mold to obtain a metal terminal strip with a plurality of hardware terminals arranged therein;

[0036] S2. Perform continuous injection molding of the obtained metal terminal material strip, so that each metal terminal is molded into a metal injection molded switch element, and a metal plastic plastic strip with a plurality of metal injection molded switch elements arranged therein is obtained;

[0037] S3, performing continuous electroplating on the obtained hardware and plastic strips, coating the terminals of each metal injection molded switch element with a protective layer, forming each metal injection molded switch element into a metal injection molded switch, and obtaining a finished strip with a number of metal injection molded switches;

[0038] S4. Cutting and mold...

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Abstract

The invention belongs to the technical field of switch accessory preparation and discloses a hardware injection molded switch preparation method. The hardware injection molded switch preparation method includes steps: S1, subjecting a hardware strip to continuous impact molding to obtain a hardware terminal strip; S2, subjecting the hardware terminal strip to continuous injection molding to obtain a hardware plastic strip with a plurality of hardware injection molded switch elements; S3, subjecting the hardware plastic strip to continuous electroplating to obtain a finished strip with a plurality of hardware injection molded switches; S4, subjecting the finished strip to shear forming to obtain a plurality of hardware injection molded switches. By means of continuous hardware impact molding, continuous injection molding and continuous electroplating, continuous automatic operations are realized, manpower and cost are saved, and the quality problem caused by plastic scraps generated in friction and terminal deformation resulted from intertwining and collision of parts in an electroplating process is solved.

Description

technical field [0001] The invention belongs to the technical field of switch accessories preparation, and relates to a preparation method of a switch formed by hardware and plastic materials. Background technique [0002] Metal injection switches are currently molded and injected with a single piece of hardware, and then divided into individual parts for barrel plating. This process is time-consuming, and it is easy to deform the terminals of the electroplated parts, and it is also easy to cause foreign matter to adhere to the metal contact parts of the product due to friction and cause quality problems. question. Contents of the invention [0003] In order to overcome the shortcomings and deficiencies of the prior art, the object of the present invention is to provide a method for preparing a metal injection switch. [0004] The object of the present invention is achieved through the following technical solutions: [0005] A method for preparing a metal injection moldi...

Claims

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Application Information

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IPC IPC(8): B29C45/14C25D5/10H01H11/00
CPCB29C45/14B29C2045/1404C25D5/10H01H11/00
Inventor 许名亮
Owner COMAX ELECTRONICS HUL ZHOU
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