Wiring board
A technology of wiring substrates and insulating substrates, which is applied to the layout details of conductive patterns, printed circuits, electrical components, etc., can solve the problems of impedance mismatch, signal reflection, and inability to transmit high-frequency signals efficiently, and achieves a lower impedance. Effect
Active Publication Date: 2016-07-13
KYOCERA CORP
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The wiring board in the present invention includes: an insulating board; external connection pads for a differential signal and external connection pads for grounding or a power supply formed on a lower surface of the insulating board; and a through-conductor formed in the insulating board. Each of the external connection pads is formed in a two-dimensional arrangement, a diameter and an arrangement pitch of the external connection pad for a differential signal are smaller than a diameter and an arrangement pitch of the external connection pad for grounding or a power supply, and an arrangement pitch of the through-conductor connected to the external connection pad for a differential signal is less than or equal to an arrangement pitch of the external connection pad for a differential signal.
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