Through hole reflow soldering device and control method thereof

Abstract

The invention discloses a through hole reflow soldering device. The through hole reflow soldering device comprises a reflow soldering machine platform. A soldering machine platform cover which can be opened and closed is arranged at the back edge of the upper plane of the reflow soldering machine platform. The upper plane of the reflow soldering machine platform is provided with a product conveying line adjustable in width. The reflow soldering machine platform is internally provided with first lower furnace pipes and second lower furnace pipes from left to right in sequence. A first warm area upper furnace pipe used for air draft is arranged in the position, corresponding to each first lower furnace pipe, of the interior of the soldering machine platform cover. A second warm area upper furnace pipe blowing cold air downwards is arranged in the position, corresponding to each second lower furnace pipe, of the interior of the soldering machine platform cover. Each first warm area upper furnace pipe and the corresponding first lower furnace pipe form a first warm area. Each second warm area upper furnace pipe and the corresponding second lower furnace pipe form a second warm area. Air blocking curtains which are used for separating the cold air from hot air and can be stretched or shortened are arranged in the positions, located between the first warm areas and the second warm areas, of the product conveying line. The reflow soldering machine platform is provided with a man-machine control interface and further provided with a cooling area. The through hole reflow soldering device is suitable for soldering of through holes of PCBs, the soldering temperature is convenient to control, and the soldering effect is better.

Description

technical field [0001] The invention relates to circuit board welding equipment, in particular to a through-hole reflow soldering device. Background technique [0002] At present, in the soldering technology of circuit boards, the commonly used soldering equipment is "wave soldering". Welding of hand inserts and glue boards of smt. Reflow soldering is mainly used in the SMT industry. It melts the solder paste printed on the PCB and welds the parts through hot air or other heat radiation conduction. However, there are some defects in the baking heating method of this wave soldering: 1. The wave soldering needs to spray flux first, and then go through the preheating, welding and cooling zone. Reflow soldering goes through a preheating zone, a reflow zone, and a cooling zone. In addition, wave soldering is suitable for hand plug-in boards and dispensing boards, and all components are required to be heat-resistant. There must be no components with SMT solder paste on the surf...

AI Technical Summary

Problems solved by technology

In addition, wave soldering is suitable for hand plug-in boards and dispensing boards, and all components are required to be heat-resistant. There must be no components with SMT solder paste on the surface of the wave peak. weld

2. There are many welding defects. After the post-test, if missing welding is found, manual repair welding is required, which requires a large amount of manual labor.

3. The required components have high temperature resistance

4. Waste of energy, consume a lot of solder bar and flux every day

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