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Thermally conductive slurry as well as preparation method and application thereof

A slurry and photothermal technology, applied in the direction of additive processing, etc., to achieve the effect of increased applicability, good stability, and reduced functional differences

Active Publication Date: 2016-07-20
ZHEJIANG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Research on electronic paste for 3D inkjet printing is extremely rare

Method used

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  • Thermally conductive slurry as well as preparation method and application thereof
  • Thermally conductive slurry as well as preparation method and application thereof
  • Thermally conductive slurry as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Add 5g of photothermal dual curing resin (epoxy acrylic resin) to 10g of diluent (absolute ethanol: viscosity 1.06mPa s, boiling point 78.4°C, surface tension 22.32mN / m, volatile), stir well to dissolve completely . Add 4g of alumina powder to the solution, stir thoroughly, and ultrasonically crush for 5 minutes to fully wet and disperse the alumina powder, use the mass conservation method to replenish the diluent lost due to volatilization, and stir evenly to obtain 19g of the product thermally conductive slurry . The performance tests are shown in Table 1.

Embodiment 2

[0027] Add 5g of photothermal dual-curing resin (epoxy acrylic resin) to 15g of diluent (absolute ethanol: viscosity 1.06mPa s, boiling point 78.4°C, surface tension 22.32mN / m, volatile), stir well to dissolve completely . Add 4g of alumina powder to the solution, stir thoroughly, and ultrasonically crush for 5 minutes to fully wet and disperse the alumina powder, use the mass conservation method to replenish the diluent lost due to volatilization, and stir evenly to obtain 24g of the product thermally conductive slurry . The performance tests are shown in Table 1.

Embodiment 3

[0029]Add 5g of photothermal dual-curing resin (epoxy acrylic resin) to 10g of diluent (propylene glycol methyl ether acetate: viscosity 1.10mPa·s, boiling point 146°C, surface tension 28.9mN / m, relatively volatile), and fully stir to dissolve completely. Add 4g of alumina powder to the solution, stir thoroughly, and ultrasonically crush for 5 minutes to fully wet and disperse the alumina powder, use the mass conservation method to replenish the diluent lost due to volatilization, and stir evenly to obtain 19g of the product thermally conductive slurry . The performance tests are shown in Table 1.

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Abstract

The invention discloses thermally conductive slurry as well as a preparation method and application thereof. The thermally conductive slurry consists of the following raw materials in parts by mass: 1 part of photo-thermal dual-curing resin, 1.5-4 parts of a diluent and 0.5-4 parts of aluminum powder, wherein the photo-thermal dual-curing resin is resin containing an acrylic group; the boiling point of the diluent is 80-150 DEG C, the viscosity is 1mPa.s-2mPa.s, the surface tension is 20 mN / m-30mN / m, and the diluent is easy to volatize; and the grain size of the aluminum oxide powder is 1-2mu m. The thermally conductive slurry disclosed by the invention adopts the photo-thermal dual-curing resin as curing matrix, so that the problem that deep curing cannot be carried out due to the fact that light is scattered, refracted and absorbed by the filler can be made up by thermal curing. Meanwhile, the method of mutually regulating by the diluent / a thixotropic agent is adopted, so that the slurry has good stability while meeting the jetting requirements of 3D inkjet printing.

Description

(1) Technical field [0001] The invention relates to a heat-conducting slurry and its preparation and application. (2) Background technology [0002] 3D inkjet printing technology is a kind of additive manufacturing (Additive Manufacturing) technology, which is an emerging rapid prototyping technology combining information technology, intelligent manufacturing and new material science. 3D inkjet printing does not require molds and subsequent processing, and is considered to have the potential to change the future of the manufacturing industry, thus attracting more and more attention from governments and industries. The position accuracy and dimensional accuracy of 3D inkjet printing are the highest among various rapid prototyping technologies, and multi-material printing can be easily realized by using multiple nozzles, so it is most suitable for manufacturing high-precision, multi-material and complex structure targets. [0003] Taking integrated circuit boards (PCB boards)...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/10C08K9/04C08K3/22B33Y70/00
CPCB33Y70/00C08K3/22C08K9/04C08K2003/2227C08L63/10
Inventor 车声雷俞海燕乔梁姚代川王立超应耀余靓李旺昌
Owner ZHEJIANG UNIV OF TECH
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