Glass ceramic composite insulator packaging shell and manufacturing method thereof

A technology of glass ceramics and packaging shells, which is applied in the direction of insulators, electrical components, circuits, etc., and can solve problems such as high technical difficulty, high material cost, and difficult processing

Active Publication Date: 2016-07-20
济南市半导体元件实验所
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, because the ceramic insulator itself is difficult to process and the cost is high, and the production process of the TO series ceramic insulator shell is cumberso

Method used

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  • Glass ceramic composite insulator packaging shell and manufacturing method thereof
  • Glass ceramic composite insulator packaging shell and manufacturing method thereof
  • Glass ceramic composite insulator packaging shell and manufacturing method thereof

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Embodiment Construction

[0038] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0039] In describing the present invention, it is to be understood that the terms "central", "axial", "radial", "longitudinal", "transverse", "length", "width", "upper", "lower" , "Front", "Back", "Left", "Right", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise", "Vertical", "Horizontal ” and other indicated orientations or...

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Abstract

The invention discloses a glass ceramic composite insulator packaging shell. The shell comprises a metal baseplate, a metal wall, a glass ceramic composite insulator, a metal sealing ring, an extraction electrode and a welding portion metallization layer. The invention provides the glass ceramic composite insulator. Advantages of a glass insulator and a ceramic insulator are possessed. Through reasonably designing structures of the insulators, an installation position, a connection method and the like, disadvantages of the two insulators are overcome. An electrical requirement of a power device to a high resistance is satisfied, and the glass ceramic composite insulator has high intensity and a high impact resistance capability so that a high reliable requirement of the power device is satisfied. A thermal resistance is small, efficiency is high and reliability is high too so that the packaging shell of the power device which is installed with the glass ceramic composite insulator possesses good performance. A production technology is simple, production efficiency is increased and large batch production is convenient. The invention also discloses a manufacturing method of the glass ceramic composite insulator packaging shell.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a glass-ceramic composite insulator packaging shell and a preparation method thereof. Background technique [0002] At present, aerospace, aviation, ships, weapons and other fields require a large number of device products with certain power requirements, which require characteristics such as small thermal resistance, good impact resistance, and high reliability, which provide a prerequisite for improving the reliability of the whole machine. The packaging shell of TO series power devices generally uses metal as the shell body, and the insulating material between the lead-out end and the metal body is generally made of glass or ceramics. [0003] The TO shell of the glass insulator is limited by factors such as poor glass strength and poor impact resistance, so it cannot be used in the field of high-reliability devices. [0004] The toughness and strength of cera...

Claims

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Application Information

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IPC IPC(8): H01B17/38H01B19/00
CPCH01B17/38H01B19/00
Inventor 杨旭东李东华相裕兵王婷刘贵庆
Owner 济南市半导体元件实验所
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