A preparation process of a multi-layer three-dimensional grid light-emitting layer and an LED light-emitting device

Abstract

The invention discloses a multilayer three-dimensional grid light-emitting layer preparation technology and an LED light-emitting device. The technology comprises the steps of coating of light-emitting material, heating, filling of transparent heat conducting material and thorough curing through heating. The LED light-emitting device comprises a bracket (1), a chip (2), a multilayer three-dimensional grid light-emitting layer (3), a sealing structure (4), the transparent heat conducting material (5) and protective material (6). The multilayer three-dimensional grid light-emitting layer preparation technology is adopted so that mutual absorption of various materials can be effectively avoided; multi-protection can be performed on the surface of the light-emitting layer, especially the quantum dot light-emitting material, by the transparent heat conducting material, a waterproof and anti-oxygen coating layer and an inorganic sealing lens so that the effects of stabilizing color spots, maintaining the lighting effect and prolonging the service life can be achieved; and the material of great light transmission and heat conduction is filled between grids so that excited light energy can be effectively utilized, the overall heat of the device can be reduced, the lighting effect can be enhanced, the service life can be prolonged and long-term reliability can be acquired.

Description

technical field [0001] The invention belongs to the technical field of semiconductor lighting applications, and in particular relates to a preparation process of a light-emitting layer and an LED light-emitting device. Background technique [0002] LED light source is a new generation of lighting products. There are three main ways to achieve white light: one is to package RGB three-color LED chips together to produce white light, and the other is to excite yellow phosphor or red-green phosphor through blue light chips. To form white light, the third is to use the ultraviolet chip to excite RGB three-color phosphors to achieve white light. However, due to the limitations of current chips, phosphors, and packaging technology, all three methods have certain deficiencies: in the first method, the three chips have different driving currents, light color changes, and attenuation conditions, which are difficult to unify. The cost is high; the second method has problems such as lo...

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Problems solved by technology

However, due to the limitations of current chips, phosphors, and packaging technology, all three methods have certain shortcomings: in the first method, the three chips have different driving currents, light color changes, and attenuation conditions, which are difficult to unify. The cost is high; the second method has problems such as low light efficiency, low CRI, uneven distribution of phosphor particles, serious loss of excitation light energy and color drift, high color gamut colloid viscosity, and difficulty in dispensing; method three is due to phosphor luminescence Low efficiency, difficult powder mixing, etc., there are hidden dangers such as ultraviolet short-wave leakage, and short aging life

However, due to the mutual absorption of spectra between phosphors, quantum dots, and phosphor quantum dots, the excitation light of the chip cannot be effectively used, resulting in waste of phosphors, quantum dots, and energy. The actual display of light color effect is not good

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