Loading and unloading mechanism for double-sided grinding and polishing

Abstract

The invention discloses a feeding and discharging mechanism for two-sided grinding and polishing. The feeding and discharging mechanism for two-sided grinding and polishing comprises a machine frame, a grinding and polishing mechanism, a conveying mechanism, at least three carrying plates, an auxiliary drive and a main drive. The grinding and polishing mechanism comprises two grinding discs. Each carrying plate comprises an outer ring, a sun gear and planetary gears, wherein installation holes used for installing a workpiece are formed in the positions of the planetary gears, and outer gear teeth are arranged on the outer ring. The conveying mechanism comprises two conveying lines. The outer rings of the carrying plates are connected between the two conveying lines at intervals. The outer gear teeth of the outer rings are engaged with the two conveying lines. The auxiliary drive drives the conveying lines to move, and the outer rings are driven to roll and walk through the movement of the conveying lines. A travel switch is used for detecting whether a certain carrying plate travels to a grinding and polishing station or not in cooperation with the carrying plate, and the planetary wheels of the carrying plate located on the grinding and polishing station are located between the two grinding discs. The main drive is in transmission connection with the sun gear of the carrying plate located on the grinding and polishing station. Feeding operation and discharging operation are achieved at the same time while grinding and polishing are conducted through a machine tool, the feeding time and discharging time are shortened, the utilization rate of the machine tool is increased, and the production efficiency is improved.

Description

technical field [0001] The invention relates to a loading and unloading mechanism for double-sided grinding and polishing. Background technique [0002] In optoelectronic semiconductor industry, national defense science and technology, aerospace and some civil fields, there are many chip parts that need to be processed, such as mobile phone screen, watch cover, precision backing ring, semiconductor substrate, etc. The processing of these chip parts not only requires High surface processing quality requires high surface accuracy. These precision parts are often hard and brittle difficult-to-machine materials, which require a large processing force, and it is difficult to meet the surface accuracy requirements by single-sided processing. Therefore, for such sheet parts, especially sheet parts, double-sided grinding and polishing (double-sided grinding, double-sided grinding, double-sided polishing, etc.) is the best processing method. Both sides are processed at the same tim...

AI Technical Summary

Problems solved by technology

When the workpiece is loaded and unloaded, the machine tool cannot work, and in industrial mass production, there are often dozens or even more of a plate of samples processed by double-sided grinding and polishing, and the time for loading and unloading the workpiece is longer, and It must be stopped during loading and unloading, so it seriously affects the efficiency of the machine tool and also seriously affects the production efficiency

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