eva hot melt adhesive for book binding

A technology of hot melt adhesives and books, applied in the direction of adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of ink resistance, reduced bond strength, high and low temperature resistance, etc.

Inactive Publication Date: 2017-10-20
SHANGHAI JENTAI NANO SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the diversification of printing products, the printing industry has begun to use various printing papers, plastic films, varnishes and inks of different grammes. Traditional EVA hot melt adhesives are often not resistant to high and low temperatures when bonding these materials. Not resistant to ink, the bond strength will decrease after the hot melt adhesive is heated three times

Method used

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  • eva hot melt adhesive for book binding
  • eva hot melt adhesive for book binding
  • eva hot melt adhesive for book binding

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Experimental program
Comparison scheme
Effect test

Embodiment approach

[0037] As an embodiment of the present invention, the VA content in the EVA resin is 20-32% by weight.

[0038] The melt index of the EVA resin is 15-400g / 10min.

[0039] In EVA hot-melt adhesives, the lower the VA content, the higher the crystallinity increases the hardness; the higher the VA content, the lower the crystallinity and the greater the elasticity. The choice of EVA melt index is also very important. The smaller the melt index, the poorer the fluidity, the higher the strength, the higher the melting temperature, and the poorer the wetting and permeability of the adherend; better, but lower bond strength.

[0040] As a most preferred embodiment of the present invention, the VA content in the EVA resin is 28% by weight.

[0041] Vinylbenzene fused heterocyclic mixture

[0042] In the present invention, the vinylbenzene fused heterocyclic compound includes vinylbenzene fused heterocyclic compound, sulfonated vinylbenzene fused heterocyclic compound, acylated ben...

Embodiment approach 1

[0124] Embodiment 1: A kind of EVA hot-melt adhesive for bookbinding, in parts by weight, is characterized in that its preparation raw materials include at least:

[0125]

[0126] Wherein, the vinylbenzene fused heterocyclic compound includes vinylbenzene fused heterocyclic compound, sulfonated vinylbenzene fused heterocyclic compound, acylated benzene fused heterocyclic compound; the vinylbenzene fused heterocyclic compound is selected from: 2-vinyl-1-benzofuran or 2-vinyl-1-benzothiophene.

Embodiment approach 2

[0127] Embodiment 2: Same as Embodiment 1, the difference is that the molar ratio of the sulfonated vinylbenzene fused heterocyclic compound to the acylated benzene condensed heterocyclic compound is: 1: (0.001-0.01).

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Abstract

The invention discloses EVA hot melt adhesive for book binding.The EVA hot melt adhesive is characterized by at least being prepared from, by weight, 100 parts of EVA resin, 1-7 parts of vinyl benzene fused-heterocycle mixture, 15-40 parts of tackifier, 10-20 parts of a viscosity conditioning agent, 0.01-0.5 part of antioxidant, 0.05-0.5 part of initiator and 20-50 parts of filler.The vinyl benzene fused-heterocycle mixture includes a vinyl benzene fused-heterocycle compound, a sulfonated vinyl benzene fused-heterocycle compound and an acylated benzene fused-heterocycle compound, and the vinyl benzene fused-heterocycle compound is selected from 2-vinyl-1-benzofuran or 2-vinyl-1-benzothiophene.

Description

technical field [0001] The invention relates to the field of hot-melt adhesives, in particular to EVA hot-melt adhesives for bookbinding, and to a preparation method for EVA hot-melt adhesives for bookbinding. Background technique [0002] In recent years, people's requirements for the quality of book binding have been increasing day by day, mainly in the relatively backward field of post-press binding. There are three main methods of book binding: wire binding, nail binding and glue binding, among which glue binding is the most commonly used method, and adhesive is an important supporting material for glue binding. There are many kinds of adhesives for book binding, mainly starch paste glue (starch paste, dextrin), animal glue (bone glue), polyvinyl acetate (PVAC) emulsion adhesive, polyethylene vinyl acetate (EVA) hot melt Adhesive, moisture curing reactive polyurethane (PUR) hot melt adhesive, etc. [0003] At present, the binding of most domestic books and periodicals ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J123/08C09J11/04C09J11/06C09J11/08
CPCC08L2201/08C08L2205/03C08L2205/035C09J11/04C09J11/06C09J11/08C09J123/0853C09J2301/304C08L93/04C08L23/06C08K2003/265C08K5/1535C08L45/00C08K5/45C08L75/04
Inventor 史立秀林进森
Owner SHANGHAI JENTAI NANO SCI & TECH CO LTD
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