LED area light source modules capable of being spliced in array

An LED surface light source and array technology, applied in the field of LED surface light source modules, can solve problems such as affecting the luminous effect, improve visual effects, ensure overall sense and safety, and avoid the exposure of wires and solder joints.

Inactive Publication Date: 2016-07-27
FUDAN UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The first is the stitching between the light-emitting surfaces. If the gap left is too large, the dark area of ​​the gap will affect the overall luminous effect

Method used

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  • LED area light source modules capable of being spliced in array
  • LED area light source modules capable of being spliced in array
  • LED area light source modules capable of being spliced in array

Examples

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Embodiment Construction

[0022] The present invention will be further explained below in conjunction with the drawings and embodiments. The described embodiments are only part of the embodiments of the present invention. All other embodiments that are based on the embodiments of the present invention without making creative results fall within the protection scope of the present invention.

[0023] A LED surface light source module that can be arrayed and spliced. Its appearance structure and part of its internal structure are as follows: figure 1 Shown. figure 2 It is a schematic diagram of distributed connection with each group of 16 chips in series and 16 groups in parallel. image 3 It is a cross-sectional view of the module of the present invention. There are 16 flip-chips on the ceramic substrate 7. The positive terminal 5 of the flip-chip is connected to the silver wire 8 on the ceramic substrate 7 through the solder paste 10, and the 16 chips are connected in series. For the chip string, the pos...

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Abstract

The invention belongs to the technical field of semiconductor lighting, and particularly relates to LED area light source modules capable of being spliced in an array. The LED area light source modules comprise LED area light source module bodies as well as a strip positive pole welding disc, a strip negative pole welding disc, a ceramic substrate and connecting wires, wherein the positive pole welding disc and the negative pole welding disc of the LED area light source module bodies are respectively arranged on two sides of the ceramic substrate; a plurality of welding spots on the positive pole welding disc and the negative pole welding disc are welded with the positive pole and negative pole connecting wires; a plurality of the LED area light source module bodies are closely distributed to form an area array LED light source module, so that the light-emitting surfaces of the LED area light source module bodies can be extended and the light source power can be improved; and the homopolar electric connection between two adjacent LED area light source module bodies on the same side can be achieved through the positive pole and negative pole connecting wires. The LED area light source modules provided by the invention have the advantages that wire grooves which are defined by dam glue are left in two sides of the positive pole welding disc and the negative pole welding disc; the positive pole and negative pole connecting wires as well as the welding spots are potted and hidden by adopting a potting sealant, and prevented from being exposed; and the transparent dam glue is adopted around a fluorescent silica gel light-emitting area, so as to reduce the dark space of the module splicing joints.

Description

Technical field [0001] The invention belongs to the technical field of semiconductor lighting, and particularly relates to an LED surface light source module that can be arrayed and spliced. Background technique [0002] The current mainstream white light LED's light-emitting principle is based on phosphor conversion, that is, the blue light of the chip is used to excite the yellow phosphor. About 2 / 3 of the blue light emitted by the chip is absorbed by the phosphor to emit yellow light, and 1 / 3 of the blue light passes through the phosphor. It emits directly, and the emitted blue light and yellow light are mixed into white light. Some LED phosphors also include green and red phosphors to improve color rendering. Regardless of the color temperature of the LED, current flows through the LED chip, and its current density and P-N junction temperature determine the level of light efficiency and the surface brightness of the white LED after packaging. [0003] The main packaging metho...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21S2/00F21V23/06F21Y105/12F21Y115/10
CPCF21S2/00F21V23/06
Inventor 张善端章开明
Owner FUDAN UNIV
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