Au-Sn-Ag series solder alloy, electronic component sealed using same Au-Sn-Ag series solder alloy, and electronic component-equipped device

A technology for solder alloys and electronic components, which is applied in the direction of assembling printed circuits, electrical components, and electrical solid-state devices with electrical components.
CN105813801AInactive Publication Date: 2016-07-27SUMITOMO METAL MINING CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SUMITOMO METAL MINING CO LTD
Publication Date
2016-07-27
Estimated Expiration
Not applicable · inactive patent

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Abstract

Provided is a lead-free, high-temperature-use Au-Sn-Ag series solder alloy that is fully usable for bonding an electronic component or an electronic component-equipped device which requires extremely high reliability, such as a liquid crystal device, a SAW filter or a MEMS; moreover, the Au-Sn-Ag series solder alloy is particularly low-cost, and has excellent workability and stress-relaxation ability, with excellent reliability. The Au-Sn-Ag series solder alloy is characterized by containing between 27.5% by mass inclusive to 33.0% by mass exclusive of Sn, between 8.0% by mass and 14.5% by mass inclusive of Ag, the remainder being constituted from Au, and more preferably, by containing between 29.0% by mass and 32.0% by mass inclusive of Sn and containing between 10.0% by mass and 14.0% by mass inclusive of Ag, and the remainder comprising Au while excluding elements that are unavoidably included during production.
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Description

technical field

[0001] The present invention relates to a lead-free solder alloy for high temperature, a solder alloy mainly composed of Au, electronic components sealed using the solder alloy, and the like. Background technique

[0002] In recent years, control of chemical substances polluting the environment has become increasingly strict, and this control is no exception for solder materials used to join electronic components and the like to substrates. Solder materials have traditionally used lead as a main component, but lead has become a controlled substance under the Rohs Directive (Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment) and the like. Therefore, lead (Pb)-free solder (hereinafter referred to as lead-free solder or lead-free solder.) is being actively developed.

[0003] Solders used when bonding electronic components to substrates are roughly classified into high-temperature (approximately 260°C to 400°C) and me...

Claims

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