Au-Sn-Ag series solder alloy, electronic component sealed using same Au-Sn-Ag series solder alloy, and electronic component-equipped device

A technology for solder alloys and electronic components, which is applied in the direction of assembling printed circuits, electrical components, and electrical solid-state devices with electrical components.

Inactive Publication Date: 2016-07-27
SUMITOMO METAL MINING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0009] But, of course, in the case of Au-20 mass% Sn alloy, the material cost is more than a little bit higher than other solder materials

Method used

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  • Au-Sn-Ag series solder alloy, electronic component sealed using same Au-Sn-Ag series solder alloy, and electronic component-equipped device
  • Au-Sn-Ag series solder alloy, electronic component sealed using same Au-Sn-Ag series solder alloy, and electronic component-equipped device
  • Au-Sn-Ag series solder alloy, electronic component sealed using same Au-Sn-Ag series solder alloy, and electronic component-equipped device

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Embodiment

[0099] Hereinafter, specific examples are given and the present invention will be described in further detail, but the present invention is not limited to these examples at all.

[0100] First, Au, Sn, Ag, Al, Cu, Ge, In, Mg, Ni, Sb, Zn, and P each having a purity of 99.9% by mass or more are prepared as raw materials. For large flakes and bulk raw materials, the melted alloy is cut, pulverized, etc. under the condition that the composition of the melted alloy does not vary due to the sampling position and is uniform, and is chopped into a size of 3mm or less. Next, predetermined amounts corresponding to the respective samples of samples 1 to 65 in Table 1 were weighed from these raw materials, respectively, and charged into graphite crucibles for high-frequency melting furnaces. Note that sample 46 and sample 52 are Au-20% by mass Sn alloys, and sample 47 and sample 53 are Au-12.5% ​​by mass Ge alloys.

[0101] The crucible containing the raw material was placed in a high-fr...

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Abstract

Provided is a lead-free, high-temperature-use Au-Sn-Ag series solder alloy that is fully usable for bonding an electronic component or an electronic component-equipped device which requires extremely high reliability, such as a liquid crystal device, a SAW filter or a MEMS; moreover, the Au-Sn-Ag series solder alloy is particularly low-cost, and has excellent workability and stress-relaxation ability, with excellent reliability. The Au-Sn-Ag series solder alloy is characterized by containing between 27.5% by mass inclusive to 33.0% by mass exclusive of Sn, between 8.0% by mass and 14.5% by mass inclusive of Ag, the remainder being constituted from Au, and more preferably, by containing between 29.0% by mass and 32.0% by mass inclusive of Sn and containing between 10.0% by mass and 14.0% by mass inclusive of Ag, and the remainder comprising Au while excluding elements that are unavoidably included during production.

Description

technical field [0001] The present invention relates to a lead-free solder alloy for high temperature, a solder alloy mainly composed of Au, electronic components sealed using the solder alloy, and the like. Background technique [0002] In recent years, control of chemical substances polluting the environment has become increasingly strict, and this control is no exception for solder materials used to join electronic components and the like to substrates. Solder materials have traditionally used lead as a main component, but lead has become a controlled substance under the Rohs Directive (Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment) and the like. Therefore, lead (Pb)-free solder (hereinafter referred to as lead-free solder or lead-free solder.) is being actively developed. [0003] Solders used when bonding electronic components to substrates are roughly classified into high-temperature (approximately 260°C to 400°C) and me...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/30C22C5/02H01L23/02H05K3/34
CPCB23K35/30B23K35/3013C22C5/02H01L2924/0002H05K3/3463H01L2924/00H05K1/18
Inventor 井关隆士
Owner SUMITOMO METAL MINING CO LTD
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