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LED Packaging Structure And Method For Manufacturing The Same

A technology of LED packaging and packaging structure, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of reduced reliability of LED chip packaging structure, low yield, and pollution of the mold space on the side of the chip.

Inactive Publication Date: 2016-08-10
EVERLIGHT ELECTRONICS
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Problems solved by technology

[0004] However, in the above-mentioned known LED chip packaging structure, when the fluorescent sheet is attached to the LED chip, the top surface of the chip is filled with adhesive glue, so in fact, when the fluorescent sheet is placed to be attached to the top surface, the top surface of the chip is filled with glue. Because the adhesive on the surface is squeezed by the fluorescent sheet, it will inevitably spill out of the top surface of the chip and pollute the side of the chip and the subsequent die space, which may lead to problems such as uneven light emission and thinning of the peripheral opaque colloid. As a result, the reliability of the LED chip packaging structure is reduced, and the yield rate is low.

Method used

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  • LED Packaging Structure And Method For Manufacturing The Same
  • LED Packaging Structure And Method For Manufacturing The Same
  • LED Packaging Structure And Method For Manufacturing The Same

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Embodiment Construction

[0067] An LED packaging structure described in the present invention uses an LED chip (such as blue LED or ultraviolet UV-LED) to emit a light beam (such as blue light or ultraviolet light), and then the light beam excites the fluorescent sheet or fluorescent colloid. To produce white light, and further provide a uniform light emitting area.

[0068] First please refer to figure 1 and Figure 2A , which are respectively a top view and a cross-sectional view of the LED packaging structure 100 according to the first embodiment of the present invention. As shown in the figure, the LED packaging structure 100 includes a substrate 110 , an LED chip 120 , a fluorescent sheet 130 and a first glue 140 . Wherein, the LED chip 120 is arranged on the substrate 110, and the LED chip 120 has an upper surface 122; the fluorescent sheet 130 has a first area, and the fluorescent sheet 130 is attached to the upper surface 122 of the LED chip 120; the first colloid 140 It is disposed on the ...

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Abstract

An LED package having a substrate, an LED chip, a phosphor sheet and a first resin is provided. The LED chip is disposed on the substrate. The phosphor sheet has a first area, and is affixed on a first surface of the LED chip. The first resin is disposed on the substrate for covering the LED chip along with the phosphor sheet, with at least a part of the phosphor sheet being exposed.

Description

technical field [0001] The present invention relates to a packaging structure and a manufacturing method thereof, in particular to an LED packaging structure and a manufacturing method thereof. Background technique [0002] In the known LED (light emitting diode, light-emitting diode) chip packaging structure, in order to make the emitted light have a uniform light-emitting area, a wavelength conversion material layer (usually containing phosphor powder) is arranged above the LED chip. Colloid) way, so that the light beam emitted by the LED chip excites the phosphor in it to emit white light, so as to provide the user with the required light source. [0003] In the known technology, in order to achieve the above-mentioned purpose of providing white light and achieve the effect of uniform light-emitting area, in the prior art, the following steps are used: first attach a fluorescent sheet to an LED chip, and then use a mold to The above-mentioned LED chip package structure i...

Claims

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Application Information

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IPC IPC(8): H01L33/50H01L33/54
CPCH01L33/505H01L33/54H01L2933/0041H01L2933/005H01L33/502H01L25/167H01L29/866H01L33/56
Inventor 潘科豪吴启铭
Owner EVERLIGHT ELECTRONICS
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