LED Packaging Structure And Method For Manufacturing The Same

[0067] The LED packaging structure described in the present invention uses an LED chip (such as blue LED or ultraviolet UV-LED) to emit a light beam (such as blue or ultraviolet light), and then the light beam excites the fluorescent sheet or the fluorescent colloid. To produce white light, and further provide a uniform light-emitting area.

[0068] Please refer first figure 1 and Figure 2A , Which are respectively a top view and a cross-sectional view of the LED packaging structure 100 according to the first embodiment of the present invention. As shown in the figure, the LED packaging structure 100 includes a substrate 110, an LED chip 120, a fluorescent sheet 130, and a first glue 140. Wherein, the LED chip 120 is disposed on the substrate 110, and the LED chip 120 has an upper surface 122; the fluorescent sheet 130 has a first area, and the fluorescent sheet 130 is attached to the upper surface 122 of the LED chip 120; the first glue 140 It is disposed on the substrate 110 to surround the LED chip 120 and the fluorescent sheet 130 and expose at least a part of the fluorescent sheet 130.

[0069] In this embodiment, the spot area of ​​the adhesive used to attach the fluorescent sheet 130 to the LED chip 120 is smaller than or equal to an upper surface of the LED chip 120.

[0070] In this embodiment, the first area of ​​the fluorescent sheet 130 is slightly larger than the area of ​​the upper surface 122 of the LED chip 120. That is, the periphery of the fluorescent sheet 130 extends beyond the upper surface 122 of the LED chip 120 to ensure that the light beam emitted by the LED chip 120 irradiates the fluorescent sheet 130 and excites the fluorescent sheet 130 to emit white light.

[0071] It should be noted that, in the first embodiment, the first gel 140 is made of an opaque material, so when it is placed on the substrate 110 around the LED chip 120 and the fluorescent sheet 130, the fluorescent sheet is exposed When at least a part of 130, the white light is only emitted from at least a part of the exposed fluorescent sheet 130.

[0072] Specifically, please refer to figure 1 , Figure 2A. In the LED packaging structure 100 of the first embodiment, the bottom of the LED chip 120 is the substrate 110, and the top is the fluorescent sheet 130, and the surroundings of the LED chip 120 and the fluorescent sheet 130 are the first glue 140.

[0073] In other words, in the first embodiment, the first glue 140 filled around the LED chip 120 and the fluorescent sheet 130 does not contact the upper surface 122 above the LED chip 120 for emitting light. Therefore, in the LED packaging structure 100 of this embodiment, the LED chip 120 is in a state of being isolated from the outside due to the relationship of being covered by the substrate 110, the fluorescent sheet 130 and the first glue 140 at the same time; and the LED chip 120 emits The light beam can only be received by the fluorescent sheet 130, and is transmitted to the outside after exciting the fluorescent sheet 130 into the required white light.

[0074] Similarly, since the periphery of the fluorescent sheet 130 is also covered by the opaque first colloid 140, the excited light can be emitted in a direction away from the fluorescent sheet 120 in a concentrated manner.

[0075] It should be noted that in order to have a better bonding structure between the LED chip 120 and the phosphor sheet 130, Figure 2B As shown, the first area of ​​the fluorescent sheet 130 is slightly larger than the upper surface 122 of the LED chip 120; and preferably, the first area of ​​the fluorescent sheet 130 beyond the upper surface 122 of the LED chip 120 faces the LED chip 120. The 120 shrinks in an oblique direction to prevent the fluorescent sheet 130 from being broken or detached from the LED chip 120 due to thermal expansion and contraction during the manufacturing process or the expansion and contraction stress generated when the first gel 140 is consolidated.

[0076] On the other hand, when the first area of ​​the phosphor sheet 130 is slightly larger than the upper surface 122 of the LED chip 120, Figure 2C As shown, the portion where the first area of ​​the phosphor sheet 130 exceeds the upper surface 122 of the LED chip 120 is a concave downward curved surface, which can also be avoided during the manufacturing process due to thermal expansion and contraction or when the first gel 140 is consolidated The resulting expansion and contraction stress causes the fluorescent sheet 130 to be broken or separated from the LED chip 120.

[0077] In addition, by such a configuration that the fluorescent sheet 130 excessively covers the LED chip 120, it can also effectively ensure that no matter whether the light beam of the LED chip 120 is emitted from the upper surface 122 or the side, it can be emitted to the fluorescent sheet 130 and excited. The white light of this embodiment improves the illuminance and light uniformity of the LED package structure 100 of this embodiment.

[0078] Please refer to image 3 , Which is a cross-sectional view of the second aspect of the LED packaging structure 100 according to the first embodiment of the present invention. in image 3 In the illustrated aspect, the LED package structure 100 includes a substrate 110, an LED chip 120, a light-transmitting patch 150, and a first glue 140. Wherein, the LED chip 120 is arranged on the substrate 110; the light-transmitting patch 150 is arranged on the substrate 110 and covers the LED chip 120; the first glue 140 is arranged on the substrate 110 and surrounds the periphery of the light-transmitting patch 150, and At least a part of the light-transmitting patch 150 is exposed. Wherein, the light-transmitting patch 150 has at least one phosphor deposition layer 130', and the first glue 140 is not in contact with the LED chip 120.

[0079] Specifically, as shown in the figure, the light-transmitting patch 150 is disposed on the upper surface of the LED chip 120. Because the periphery of the light-transmitting patch 150 is covered by the opaque first gel 130, the LED chip 120 After the emitted light beam is emitted to the light-transmitting patch 150 and excites the phosphor deposition layer 130 ′ therein to become the required white light, it is emitted in a direction away from the phosphor sheet 120 and transmitted to the outside.

[0080] Please continue reference Figure 4A and Figure 4B , Which are respectively a top view and a cross-sectional view of the second embodiment of the LED packaging structure of the present invention.

[0081] As shown in the figure, the second embodiment of the LED packaging structure 100 of the present invention is similar to the aforementioned figure 1 , Figure 2A The first embodiment shown may also include a substrate 110, an LED chip 120, a phosphor sheet 130 or a light-transmitting patch 150 with at least one phosphor deposition layer 130', and a first colloid 140.

[0082] The difference between the first embodiment and the second embodiment of the LED packaging structure 100 is that the LED packaging structure 100 of the second embodiment further includes a Zener Diode chip 400, so that the LED packaging structure 100 additionally has a stable voltage function.

[0083] In detail, such as Figure 4A , Figure 4B As shown, in the second embodiment, the Zener diode chip 400 is disposed on the substrate 110 and is juxtaposed with the LED chip 120. The Zener diode chip 400 can be electrically connected to the substrate 110 by means of wire bonding, soldering, eutectic or flip chip. In addition, such as Figure 4B As shown, since the Zener diode chip 400 is covered by the first glue 140, after the first glue 140 is filled, the Zener diode chip 400 will be isolated from the outside. In addition, since the first colloid 140 is made of an opaque material, the Zener diode chip 400 cannot Figure 4A It is seen in the top view shown.

[0084] The top view and cross-sectional view of the third embodiment of the LED packaging structure of the present invention are as follows Figure 5A and Figure 5B Shown. As shown in the figure, the LED packaging structure 200 of the third embodiment includes a substrate 210, an LED chip 220, a fluorescent glue 230, and a first glue 240. Among them, the LED chip 220 is disposed on the substrate 210; the fluorescent gel 230 is disposed on the substrate 210 and is used to cover the LED chip 220; the first gel 240 is disposed on the substrate 210 and surrounds the periphery of the fluorescent gel 230 to reveal At least a part of the fluorescent gel 230 makes the first gel 240 not contact the LED chip 220.

[0085] In this embodiment, the fluorescent colloid 230 is a colloid doped with a fluorescent material or is directly made of a fluorescent material. Because the fluorescent gel 230 is disposed on the substrate 210 and covers the LED chip 220, the LED chip 220 is further isolated from the outside.

[0086] In addition, the first colloid 240 is also made of an opaque material. Therefore, when the first colloid 240 is disposed on the substrate 210 and surrounds the periphery of the fluorescent colloid 230, at least a part of the fluorescent colloid 230 is exposed. Because 210 and the fluorescent gel 230 have isolated the LED chip 220 from the outside, the first gel 240 will not be in contact with the LED chip 220.

[0087] In this way, because the LED chip 220 and the fluorescent colloid 230 are surrounded by the opaque first colloid 240, when the fluorescent colloid 230 is excited by the light beam emitted by the LED chip 220, the excited white light will be concentrated It emits in a direction perpendicular to and away from the fluorescent gel 230.

[0088] It should be noted that, in the third embodiment, the fluorescent gel 220 may have a rectangular cross-section, a narrow top and a wide cross section, or a trapezoidal cross-section to ensure the concentration of the light-emitting surface and enhance the illuminance.

[0089] Therefore, the LED package structure 200 of the third embodiment has the advantage that all the light beams emitted from the LED chip 220 can be absorbed by the fluorescent colloid 230, thereby exciting the required white light; and, it can directly change the The thickness of the filled fluorescent gel 230 enables the LED package structure 300 to achieve the required customized height, simplifying the required processing steps.

[0090] The top view and cross-sectional view of the fourth embodiment of the LED packaging structure of the present invention are as follows Figure 6A and 6B As shown in the figure. The LED packaging structure 200 of the fourth embodiment is similar to the third embodiment, and can also include a substrate 210, an LED chip 220, a fluorescent gel 230, and a first gel 240. The difference between the LED packaging structure 200 of the fourth embodiment and the third embodiment is that the LED packaging structure 200 of the fourth embodiment further includes a Zener diode chip 400.

[0091] In detail, such as Figure 6B In the first aspect of the fourth embodiment shown, the Zener diode chip 400 is disposed on the substrate 210, adjacent to the LED chip 220, and is covered by the fluorescent gel 230. Therefore, since the Zener diode chip 400 is also covered by the fluorescent gel 230, the Zener diode chip 400 of the fourth embodiment is also in a form of isolation from the outside.

[0092] It’s important to note that in Figure 6B In the first aspect of the fourth embodiment shown, the fluorescent gel 230 covering the Zener diode chip 400 and the fluorescent gel 230 covering the LED chip 220 are in communication with each other. That is, the fluorescent gel 230 provided between the LED chip 220 and the Zener diode chip 400 has a continuous state. In other words, in Figure 6B In the cross-sectional view shown, the fluorescent gel 230 covers the substrate 210 between the LED chip 220 and the Zener diode chip 400, so that the first gel 240 does not contact the substrate 210 between the LED chip 220 and the Zener diode chip 400.

[0093] The second aspect of the fourth embodiment of the LED packaging structure of the present invention is as Figure 6C Shown. The difference between the second aspect of the fourth embodiment and the first aspect described above is that the fluorescent gel 230 covering the Zener diode chip 400 and the fluorescent gel 230 covering the LED chip 220 are in a form of disconnection.

[0094] That is, as Figure 6C As shown in the cross-sectional view, the fluorescent colloid 230 covering the LED chip 220 and the fluorescent colloid 230 covering the Zener diode chip 400 are separated by a distance. Therefore, the first colloid 240 will be filled in the distance And contact the substrate 210 between the LED chip 220 and the Zener diode chip 400.

[0095] In this way, through such Figure 6C With the structure shown, after the light beam is emitted from the LED chip 220, it will only propagate between the fluorescent colloids 230 disposed on the periphery of the LED chip 220, and cannot propagate to the fluorescent colloid 230 disposed on the periphery of the Zener diode chip 400. In this way, the light loss can be avoided and the effect of enhancing the illuminance can be further achieved.

[0096] The third aspect of the fourth embodiment of the LED packaging structure of the present invention is as Figure 6D Shown. The difference between the third aspect of the fourth embodiment and the first aspect described above is that the fluorescent gel 230 covering the Zener diode chip 400 and the fluorescent gel 230 covering the LED chip 220 are not only disconnected from each other, but also The substrate 210 is further formed with a recessed portion 212, and the bottom of the recessed portion 212 can present a chamfered shape to avoid light loss and further achieve the effect of enhancing the illuminance.

[0097] Figure 7A and Figure 7B These are the top view and cross-sectional view of the fifth embodiment of the LED packaging structure of the present invention. As shown in the figure, the LED packaging structure 300 of the fifth embodiment has a substrate 310, an LED chip 320, a fluorescent paint 330, a transparent glue 340, and a first glue 350. Among them, the LED chip 320 is arranged on the substrate 310; the fluorescent paint 330 is used to cover the LED chip 320; the transparent glue 340 is arranged on the substrate 310 to cover the LED chip 320 and the fluorescent paint 330; the first glue 350 is arranged on the substrate 310 It is arranged around the periphery of the transparent glue 340 to expose at least a part of the transparent glue 340, and the first glue 350 is not in contact with the LED chip 320.

[0098] In detail, in this embodiment, the fluorescent paint 330 is made of transparent paint with high volatility and fluorescent material added, or is directly made of fluorescent material, and the fluorescent paint 330 is used to cover the surface of the LED chip 320 . That is, the fluorescent paint 330 is in the form of a coating or a thin film, and at least covers the upper surface of the LED chip 320.

[0099] The transparent colloid 340 is a colloid with high light transmittance, which is disposed on the substrate 310 and covers the LED chip 320 and the fluorescent paint 330. Specifically, the transparent colloid 340 is wrapped around and above the LED chip 320 and the fluorescent paint 330 so as to isolate the LED chip 320 and the fluorescent paint 330 from the outside. Therefore, in the fifth embodiment, the first glue 350 will not be in contact with the LED chip 310.

[0100] In addition, the advantage of using the fluorescent paint 330 and the transparent colloid 340 is that spraying the fluorescent paint 330 on the LED chip 320 can avoid the problem that the fluorescent sheet may be broken in the prior art, and by controlling the thickness of the transparent colloid 340, the LED The package structure 300 reaches the height required for customization.

[0101] On the other hand, the transparent colloid 340 can also have a rectangular cross section, a narrow top and a wide cross section, or a trapezoidal cross section to ensure the concentration of the light-emitting surface and enhance the illuminance.

[0102] It should be noted that, in practice, when the fluorescent paint 330 is sprayed on the LED chip 320 to cover the upper surface of the LED chip 320, due to the effect of gravity, when the fluorescent paint 320 is cured, it will show a It is attached to the surface of the LED chip 320 in the form of microparalysis.

[0103] The only difference between the LED packaging structure 300 of the fifth embodiment and the LED packaging structure 100 of the first embodiment is that the LED packaging structure 300 of the fifth embodiment uses a combination of a fluorescent paint 330 and a transparent colloid 340 instead of the first The fluorescent sheet 130 included in the LED packaging structure 100 of an embodiment.

[0104] Figure 8A and Figure 8B These are the top view and the cross-sectional view of the sixth embodiment of the LED packaging structure of the present invention. The LED packaging structure 300 of the sixth embodiment is similar to the fifth embodiment, and may also include a substrate 310, an LED chip 320, a fluorescent paint 330, a transparent colloid 340, and a first colloid 350. The difference between the LED packaging structure 300 of the sixth embodiment and the fifth embodiment is that the LED packaging structure 300 of the sixth embodiment may further include a Zener diode chip 400.

[0105] In detail, such as Figure 8B In the first aspect of the sixth embodiment shown, the Zener diode chip 400 is disposed on the substrate 310, and since the Zener diode chip 400 is adjacent to the LED chip 320, it can also be covered by a transparent gel 340 .

[0106] It’s important to note that in Figure 8B In the first aspect of the sixth embodiment shown, the transparent glue 340 covering the Zener diode chip 400 and the transparent glue 340 covering the LED chip 320 are in communication with each other. That is, the transparent colloid 340 between the LED chip 320 and the Zener diode chip 400 has a continuous state. In other words, in Figure 8B In the cross-sectional view shown, the transparent glue 340 covers the substrate 310 between the LED chip 320 and the Zener diode chip 400, so that the first glue 350 does not contact the substrate 310 between the LED chip 320 and the Zener diode chip 400.

[0107] The second aspect of the sixth embodiment of the LED packaging structure of the present invention is as Figure 8C Shown. The difference between the second aspect of the sixth embodiment and the first aspect described above is that the transparent colloid 340 covering the Zener diode chip 400 and the transparent colloid 340 covering the LED chip 320 are not connected to each other.

[0108] That is, as Figure 6C As shown in the cross-sectional view, the transparent colloid 340 covering the LED chip 320 and the transparent colloid 340 covering the Zener diode chip 400 are separated by a distance. Therefore, the first colloid 350 will be filled in the distance And contact the substrate 310 between the LED chip 320 and the Zener diode chip 400.

[0109] In this way, through such Figure 8C With the structure shown, after the light beam is emitted from the LED chip 320, it will only propagate between the transparent glue 340 arranged on the periphery of the LED chip 320, and cannot penetrate the transparent glue 340 arranged on the periphery of the Zener diode chip 400. In this way, the light loss can be avoided and the effect of enhancing the illuminance can be further achieved.

[0110] The third aspect of the sixth embodiment of the LED packaging structure of the present invention is as Figure 8D Shown. The difference between the third aspect of the sixth embodiment and the above-mentioned first aspect is that the transparent colloid 340 covering the Zener diode chip 400 and the transparent colloid 340 covering the LED chip 320 are not only disconnected from each other, but also The substrate 310 is further formed with a recessed portion 312, and the bottom of the recessed portion 312 can present a chamfered shape, so as to prevent the light beam emitted by the LED chip 320 from penetrating the Zener diode chip 400 and cause light loss, and further improve the illumination Effect.

[0111] The manufacturing method and steps of each embodiment of the LED package structure of this case will be described below.

[0112] Picture 9 It is a schematic diagram of the manufacturing method and steps of the first embodiment of the LED packaging structure of the present invention. As shown in the figure, the method of manufacturing the LED package structure 100 may include the following steps:

[0113] First, in step S1, a substrate 110 is provided; then in step S2, an LED chip 120 is placed on the substrate 110 by means of adhesion, soldering or die bonding; in step S3, a fluorescent sheet 130 is attached to the LED An upper surface 122 of the chip 120. The area of ​​the attached fluorescent sheet 130 is larger than the area of ​​the upper surface 122 of the LED chip 120 (approximately equal to the area of ​​the substrate 110). Then in step S4, the fluorescent sheet 130 is cut so that the area of ​​the fluorescent sheet 130 is finally only slightly larger than the area of ​​the upper surface 122 of the LED chip 120. Finally, in step S5, a first gel 140 is made to cover the LED chip 120 and the fluorescent sheet 130 to expose at least a part of the fluorescent sheet 130. In this way, you can get corresponding Figure 2A The LED package structure 100 is shown.

[0114] It should be noted that after step S2, the fluorescent sheet 130 having an area only slightly larger than the area of ​​the upper surface 122 of the LED chip 120 can also be directly attached to the LED chip 120, thereby omitting step S3 and proceeding directly to step S4.

[0115] Moreover, in step S4, when pressure is applied to the fluorescent sheet 130, the pressure can be further used to cause the fluorescent sheet 130 to be disposed on the upper surface 122 of the LED chip 120 in a manner of being retracted obliquely toward the LED chip 120 (such as Figure 2B As shown), or make the part of the phosphor sheet 130 beyond the upper surface 122 of the LED chip 120 to form a concave downward curved surface (such as Figure 2C (Shown) in order to avoid thermal expansion and contraction during the subsequent manufacturing process or the expansion and contraction stress generated when the first gel 140 is consolidated, causing the fluorescent sheet 130 to break or separate from the LED chip 120, and to ensure that the LED chip The light beam 120 is emitted from the upper surface 122 or the side surface of the LED chip 120, and can be emitted to the fluorescent sheet 130 and excite the required white light, thereby improving the illuminance and light uniformity of the LED package structure 100 of this embodiment.

[0116] Furthermore, before step S5 is performed, the light-transmitting patch 150 can also be placed on the fluorescent sheet 130, and then pressure is applied to the light-transmitting patch 150 with a mold, and the first gel 140 is filled to cover the LED chips 120, The fluorescent sheet 130 and the light-transmitting patch 150 enable the LED packaging structure 100 to have the aforementioned image 3 Structure. In other words, with the arrangement of the light-transmitting patch 150, the overall height of the LED package structure 100 can be adjusted according to different customization requirements.

[0117] On the other hand, in the process of step S5, a mold (not shown in the figure) can be used to apply a pressure to the fluorescent sheet 130 and fill a gap between the mold and the substrate 110 and the fluorescent sheet 130 by the first glue 140. In this way, when the mold is removed, the LED packaging structure 100 of the first embodiment of the present case is completed. Moreover, since the first glue 140 only fills the upper surface of the substrate 110 and the periphery of the LED chip 120 and the fluorescent sheet 130, the first glue 140 does not cover the upper surface of the fluorescent sheet 130.

[0118] If you want to make large quantities such as Figure 2A The LED package structure 100 shown, you can refer to Picture 9 In the steps shown, after a substrate 110 with a large area is provided, a plurality of LED chips 120 are arranged on the substrate 110 in a matrix arrangement, and a fluorescent sheet 130 having an area approximately the same as the substrate 110 is placed on the plurality of LEDs. After the chip 120 is placed, the fluorescent sheet 130 is cut, the first glue 140 is filled so that the first glue 140 covers a plurality of LED chips 120 and the fluorescent sheet 130, and finally cut with a knife, you can obtain the following Figure 2A A single LED package structure 100 is shown.

[0119] Similarly, if you want to manufacture in large quantities like image 3 In the LED package structure 100 shown, the steps are also the same as those described above. The difference is only that there is one more step of arranging the light-transmitting patch 150, so it will not be repeated here.

[0120] Picture 10 It is a schematic diagram of the manufacturing method and steps of the second embodiment of the LED packaging structure of the present invention. As shown in the figure, the method of manufacturing the LED packaging structure 100 may include the following steps:

[0121] First, in step S1, a substrate 110 is provided; then in step S2, an LED chip 120 is placed on the substrate 110 by means of adhesion, welding or die bonding; in step S3, a fluorescent sheet 130 is attached to the LED An upper surface 122 of the chip 120. The area of ​​the attached fluorescent sheet 130 is larger than the area of ​​the upper surface 122 of the LED chip 120 (approximately equal to the area of ​​the substrate 110). Then, in step S4, the fluorescent sheet 130 is cut so that the area of ​​the fluorescent sheet 130 is finally only slightly larger than the area of ​​the upper surface 122 of the LED chip 120. In step S5, a Zener diode chip 400 is disposed on the substrate 110. Finally, in step S6, the LED chip 120, the fluorescent sheet 130, and the Zener diode chip 400 are covered with a first gel 140 to expose at least a part of the fluorescent sheet 130. In this way, you can get corresponding Figure 4A , Figure 4B The LED package structure 100 is shown.

[0122] In other words, Picture 10 The steps shown are roughly the same as Picture 9 , The only difference is Picture 10 In the steps shown, the Zener diode chip 400 needs to be set up before the first gel 140 is filled. In addition to the above differences, Picture 10 The other steps are the same as Picture 9 , So I won't repeat it here.

[0123] Figure 11A It is a schematic diagram of the manufacturing method and steps of the third embodiment of the LED packaging structure of the present invention. As shown in the figure, the method of manufacturing the LED packaging structure 200 may include the following steps:

[0124] First, in step S1, a substrate 210 is provided; in step S2, an LED chip 220 is disposed on the substrate 210; in step S3, a fluorescent gel 230 is molded on the substrate 210 to cover the LED chip 220; In step S4, the fluorescent colloid 230 is cut along the periphery of the LED chip 220; and, in step S5, a first colloid 240 is molded on the substrate 210 so that the first colloid 240 covers the fluorescent colloid 230 to expose the fluorescent colloid 230 At least a part, and the first glue 240 is not in contact with the LED chip 220.

[0125] In other words, on completion Figure 11A After step S5, the LED package structure 200 as shown in Figures 5A and 5B will be obtained.

[0126] It should be reminded that in Figure 11A In step S4, a cutter (not shown) is used to cut the fluorescent colloid 230 from top to bottom along the periphery of the LED chip 220. Therefore, in an ideal state, after the fluorescent colloid 230 is cut, it will still be perpendicular to The wall surface of the substrate 210.

[0127] However, as Figure 11B As shown, the cutting angle of the cutter can also be controlled, so that the fluorescent gel 230 arranged around the LED chip 220 has a narrow top and a wide cross section after being cut, and effectively controls the light beam emitted by the LED chip 220 to excite the fluorescent gel. The light path at 230 o'clock can avoid light loss and further improve the illuminance.

[0128] Picture 12 It is a schematic diagram of the manufacturing method and steps of the fourth embodiment of the LED packaging structure of the present invention. As shown in the figure, the method of manufacturing the LED packaging structure 200 may include the following steps:

[0129] First, as shown in step S1, a substrate 210 is provided; as shown in step S2, an LED chip 220 and a Zener diode chip 400 adjacent to the LED chip 220 are disposed on the substrate 210; as shown in step S3, a mold The fluorescent glue 230 is on the substrate 210 to cover the LED chip 220 and the Zener diode chip 400; as shown in step S4, the fluorescent glue 230 is cut along the periphery of the LED chip 220 and the Zener diode chip 400; finally, as in step S5 As shown, a first glue 240 is molded on the substrate 210 so that the first glue 240 is arranged around the periphery of the fluorescent glue 240, and at least a part of the fluorescent glue 240 on the LED chip 220 is exposed, and the first glue 240 is not The LED chip 220 and the Zener diode chip 400 are in contact.

[0130] It should be noted that in Picture 12 In the step S4 shown, when a knife (not shown in the figure) is used to cut the fluorescent gel 230 disposed between the LED chip 220 and the Zener diode chip 400, the knife does not touch the substrate 210. Therefore, the same as before Figure 6B The fluorescent colloid 230 disposed between the LED chip 220 and the Zener diode chip 400 has a continuous pattern.

[0131] Such as Picture 12 As shown in S5, preferably, in this embodiment, the fluorescent gel 230 covering the LED chip 220 and the Zener diode chip 400 has a cross section with a narrow top and a wide bottom, so the light beam is emitted from the LED chip 220 and excites fluorescence The white light generated after the colloid 230 will be emitted out of the LED package structure 200 in a concentrated manner.

[0132] In addition, when Picture 12 When controlling the knife to cut the fluorescent gel 230 in step S5, the knife can also be undercut or overcut to the substrate 210. Therefore, the subsequently filled first gel 240 will be filled between the LED chip 220 and the Zener diode chip 400, and contact the substrate 210 between the LED chip 220 and the Zener diode chip 400, and appear as described above Figure 6C , Figure 6D The appearance.

[0133] In this way, when the LED package structure 200 is Figure 6C , Figure 6D When the light beam is emitted from the LED chip 220, it will only propagate between the fluorescent colloids 230 arranged on the periphery of the LED chip 220, and cannot propagate to the fluorescent colloids 230 arranged on the periphery of the Zener diode chip 400. In other words, with this arrangement, the light loss can be avoided and the effect of increasing the illuminance can be further achieved.

[0134] In the above step S4 of cutting the fluorescent gel 230 with a knife, it can be further divided into a single cutting of the fluorescent gel 230 and a multiple cutting of the fluorescent gel 230. That is, when the knife used is wider, the excess fluorescent colloid 230 can be removed by a single cut. When the knife used is narrow, the excess fluorescent gel 230 can be removed by cutting multiple times.

[0135] It should be noted that even if the excess fluorescent colloid 230 is removed by multiple cuttings, the fluorescent colloid 230 above the Zener diode chip 400 forms a jagged or wavy surface, which is different from Picture 12 The flat surface shown in step S4 of step S4, the fluorescent colloid 230 existing above the Zener diode chip 400 forms a jagged or wavy surface, which should still belong to the technical feature of the present application.

[0136] Figure 13 It is a schematic diagram of the manufacturing method and steps of the fifth embodiment of the LED packaging structure of the present invention. As shown in the figure, the method of manufacturing the LED packaging structure 300 may include the following steps:

[0137] First, as shown in step S1, a substrate 310 is provided; as shown in step S2, an LED chip 320 is disposed on the substrate 310; as shown in step S3, a fluorescent paint 330 is sprayed on the LED chip 320; as shown in step S4 As shown, a transparent gel 340 is molded on the substrate 310 to cover the LED chip 320 and the fluorescent paint 330; as shown in step S5, the transparent gel 340 is cut around the LED chip 320; finally, as shown in step S6, a first A glue 350 is placed on the substrate 310 so that the first glue 350 is arranged around the periphery of the transparent glue 340 to expose at least a part of the transparent glue 340, and the first glue 350 is not in contact with the LED chip 320.

[0138] Therefore, the same as Figure 7A , 7B In the description of the fifth embodiment, since the transparent colloid 340 is a colloid with high light transmittance, when it is disposed on the substrate 310 and covers the LED chip 320 and the fluorescent paint 330, the LED chip 320 and the fluorescent paint 330 All are isolated from the outside, and the first gel 350 will not contact the LED chip 310. Moreover, by directly changing the thickness of the transparent gel 340, the LED package structure 300 can reach the height required for customization.

[0139] Figure 14 It is a schematic diagram of the manufacturing method and steps of the sixth embodiment of the LED packaging structure of the present invention. As shown in the figure, the method of manufacturing the LED packaging structure 300 may include the following steps:

[0140] First, as shown in step S1, a substrate 310 is provided; as shown in step S2, an LED chip 320 and a Zener diode chip 400 adjacent to the LED chip 320 are arranged on the substrate 310; as shown in step S3, a Fluorescent paint 330 is placed on the LED chip 320; as shown in step S4, a transparent gel 340 is molded on the substrate 310 to cover the LED chip 320 and the Zener diode chip 400; as shown in step S5, the LED chip 310 is aligned with The transparent glue 340 is cut around the nanodiode chip 400; finally, as shown in step S6, a first glue 350 is molded on the substrate 310 so that the first glue 350 is arranged around the periphery of the transparent glue 340 to expose the LED chip 320 At least a part of the transparent colloid 340 of, and the first colloid 350 is not in contact with the LED chip 320 and the Zener diode chip 400.

[0141] Therefore, the same as Figure 8A , 8B In the description of the sixth embodiment of the figure, since the transparent colloid 340 is a colloid with high light transmittance, when it is disposed on the substrate 310 and covers the LED chip 320, the Zener diode chip 400 and the fluorescent paint 330, it will make The LED chip 320, the Zener diode chip 400, and the fluorescent paint 330 are all isolated from the outside, and the first gel 350 does not contact the LED chip 310 and the Zener diode chip 400. At the same time, by directly changing the thickness of the transparent gel 340, the LED package structure 300 can reach the height required for customization.

[0142] In addition, similar to Picture 12 When Figure 13 When the knife is controlled to cut the transparent gel 340 in step S5, the knife can also be undercut or overcut to the substrate 310. Therefore, the subsequently filled first gel 350 will be filled between the LED chip 320 and the Zener diode chip 400, and contact the substrate 310 between the LED chip 320 and the Zener diode chip 400, and appear as described above Figure 8C , Figure 8D The appearance.

[0143] In this way, when in Figure 8B , Figure 8C When the light beam is emitted from the LED chip 320, it will only propagate between the transparent colloid 340 disposed on the periphery of the LED chip 320, and cannot propagate to the transparent colloid 340 disposed on the periphery of the Zener diode chip 400. In other words, with this arrangement, the light loss can be avoided and the effect of increasing the illuminance can be further achieved.

[0144] In summary, the LED package structure proposed in the various embodiments of the present invention can be produced by the equipment required by the existing manufacturing process, and at the same time, it can provide a more uniform light-emitting area and prevent the phosphor from being broken or self-LED The disengagement of the chip improves the reliability of the finished product, and provides better protection for the LED chip and the Zener diode chip.

[0145] Although the present invention has been disclosed as above in the preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art can make some modifications and improvements without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of protection shall be as defined in the claims.