Multilayer copper/titanium composite board and preparation method thereof

A composite board and multi-layer copper technology, which is applied in the field of metal materials, can solve problems such as unseen problems, and achieve the effects of uniform structure, elimination of stress concentration, and uniform distribution of two-phase structures

Active Publication Date: 2016-08-17
NORTHEASTERN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

So, for multilayer composites composed of hexagonal and cubic metals, how does the stress state at the heterointerface affect the plastic deformation of hexagonal metals? How are strains coordinated between preferentially activated dislocations, twins and shear bands and heterointerfaces in cubic metals? Furthermore, the chan

Method used

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  • Multilayer copper/titanium composite board and preparation method thereof
  • Multilayer copper/titanium composite board and preparation method thereof
  • Multilayer copper/titanium composite board and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] (1) Prepare pure copper plates and pure titanium plates with the same area and thickness, and perform pre-rolling treatment on the pure copper plates and pure titanium plates to weaken the initial texture of the metal. Vacuum annealing at ℃ for 20 minutes; vacuum anneal the pure titanium plate at 700±1 ℃ and keep it for 1 hour; remove the surface oil and oxide layer of the pure copper plate and pure titanium plate after annealing and heat preservation respectively; pure copper plate and pure titanium plate The thickness is 1 mm;

[0051] (2) Cross-stack 4 pure copper plates and 3 pure titanium plates after pre-rolling to form a multi-layer board, and the number of layers of the multi-layer board is 7;

[0052] (3) Carry out one synchronous compound rolling of the multi-layer plate under the condition of 300±1 ℃, with a reduction of 65%, to make a primary composite plate;

[0053] (4) Heat the primary composite board at 500±1 °C for 1 h for stress relief annealing, and ...

Embodiment 2

[0058] Method is with embodiment 1, and difference is:

[0059] (1) The vacuum annealing time of pure copper plate is 25 min; the vacuum annealing time of pure titanium plate is 1.2 h;

[0060] (2) Stress relief annealing time 1.5 h; cut into 2 composite sub-plates with the same area;

[0061] (3) Repeat the stress relief annealing-cutting step and the stacking-rolling step once for the secondary composite board, and when repeating the stress relief annealing-cutting step, cut into 3 composite sub-boards with the same area to make multilayer copper / Titanium composite plate;

[0062] (4) The multi-layer copper / titanium composite plate is composed of 42 layers of titanium layer and copper layer. The thickness of each metal layer is 37 μm, the tensile strength is 380 MPa, the yield strength is 305 MPa, and the elongation 25%.

Embodiment 3

[0064] Method is with embodiment 1, and difference is:

[0065] (1) The vacuum annealing time of pure copper plate is 30 min; the vacuum annealing time of pure titanium plate is 1.5 h;

[0066] (2) Stress relief annealing time 2 h; cut into 2 composite sub-plates with the same area;

[0067] (3) The secondary composite board is used as a finished multi-layer copper / titanium composite board;

[0068] (4) The multi-layer copper / titanium composite plate is composed of 14 layers of titanium layer and copper layer. The thickness of each metal layer is 111 μm, the tensile strength is 365 MPa, the yield strength is 306 MPa, and the elongation 25%.

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Abstract

Provided are a multilayer copper/titanium composite board and a preparation method thereof. The multilayer copper/titanium composite board is composed of two types of 7-126 metal layers equal in thickness, wherein the metal layers are titanium or copper layers, the thickness is 12-333 microns, the tensile strength is 355-355 MPa, the yield strength is 295-325 MPa, and the elongation percentage is 16-31%. The preparation method comprises the steps that pure copper and pure titanium boards are subjected to rolling pretreatment; one-pass synchronous composite rolling is performed to form a multilayer copper/titanium composite board finished product after cross stacking, or repeated cutting, stacking and rolling are performed, and annealing is performed between every two adjacent times of rolling. By the adoption of the preparation method, a high-plasticity multilayer copper/titanium laminated composite material of a uniformly distributed diphase structure can be obtained and has the important value on rapidly developing micro components and devices, micro electro mechanical systems, biological materials and development of the high and new technology fields including nuclear industry and the like.

Description

technical field [0001] The invention belongs to the technical field of metal materials, in particular to a copper / titanium multilayer composite board and a preparation method thereof. Background technique [0002] Metal layered composites composed of dissimilar metals alternately stacked at a finer scale (micron, submicron or even nanometer) unit layer thickness, due to their high strength / hardness, excellent resistance to radiation damage, etc., are currently used in micro components, High-tech fields such as micro-electromechanical systems, biological materials and nuclear industry have been widely used. This type of material often needs to withstand large strain deformation and cyclic load during processing and subsequent service, which puts forward high requirements on its ability to resist plastic deformation damage. Therefore, the research and development of layered metal composites has become a The focus of attention in the field of materials. For layered composites...

Claims

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Application Information

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IPC IPC(8): B32B15/01C22F1/08C22F1/18C22F1/02C21D9/46
CPCB32B15/01B32B2307/202B32B2307/302B32B2307/752C21D9/46C22F1/02C22F1/08C22F1/183
Inventor 贾楠周晓欢姜爽张辉郑毅然赵骧
Owner NORTHEASTERN UNIV
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