Cross-scale simulation method for thermal-state characteristic of key part of high-speed stamping device

Abstract

The invention discloses a cross-scale simulation method for a thermal-state characteristic of a key part of a high-speed stamping device. The method comprises the steps of firstly, determining a main heat source and a heating value of the main heat source for the key part of the high-speed stamping device in a working process; secondly, determining a heat transfer path and a heat transfer way which influence temperature field distribution of the key part, and calculating a convection heat exchange coefficient; thirdly, obtaining a fractal dimension and a characteristic length of a solid rough surface of the key part, simulating the solid rough surface, comprehensively considering three different deformation mechanisms of elasticity, plasticity and elastoplasticity, and computing contact heat resistance to obtain contact heat transfer coefficients of various solid contact surfaces; and finally, performing finite element simulation analysis on the thermal-state characteristic of the key part of the high-speed stamping device. According to the method, multiple deformation mechanisms are considered and deformation is divided into three conditions for computing matrix heat resistance under the condition of considering a dynamic friction factor, so that the simulation method can analyze the thermal-state characteristic of the key part of the high-speed stamping device more comprehensively and accurately, and the actual condition is better met.

Description

technical field [0001] The invention relates to the technical field of high-speed stamping, in particular to a cross-scale simulation method for thermal characteristics of key components of high-speed stamping equipment. Background technique [0002] There are mainly test methods and simulation methods for the analysis of thermal characteristics of key components of high-speed stamping equipment. The test method requires a large number of experiments to complete the measurement of the temperature field of the whole machine. When collecting temperature information, it is impossible to arrange sensors on the whole machine, but usually in some parts of the stamping equipment. The position of the sensor directly affects the accurate collection of temperature information. , which ultimately affects the accuracy of the thermal analysis model. In addition, the test method requires more equipment, is more expensive, and is not universal. The simulation method uses the existing fin...

AI Technical Summary

Problems solved by technology

The test method requires a large number of experiments to complete the measurement of the temperature field of the whole machine. When collecting temperature information, it is impossible to arrange sensors on the whole machine, but usually in some parts of the stamping equipment. The position of the sensor directly affects the accurate collection of temperature information. , which ultimately affects the accuracy of the thermal analysis model

In addition, the test method requires more equipment, the cost is more expensive, and it is not universal.

Images