A cross-scale simulation method for thermal characteristics of key components of high-speed stamping equipment
A technology of high-speed stamping and simulation method, which is applied in the field of high-speed stamping, can solve the problems of many equipment, high cost, and lack of versatility, and achieve the effect of comprehensive calculation model and comprehensive analysis
Active Publication Date: 2018-05-29
ZHEJIANG UNIV
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Problems solved by technology
The test method requires a large number of experiments to complete the measurement of the temperature field of the whole machine. When collecting temperature information, it is impossible to arrange sensors on the whole machine, but usually in some parts of the stamping equipment. The position of the sensor directly affects the accurate collection of temperature information. , which ultimately affects the accuracy of the thermal analysis model
In addition, the test method requires more equipment, the cost is more expensive, and it is not universal.
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[0027] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.
[0028] The cross-scale simulation process of the thermal characteristics of key components of high-speed stamping equipment is as follows: figure 1 shown. Taking the simulation analysis of the thermal characteristics of the force-applying mechanism of high-speed stamping equipment as an example, the main steps of the cross-scale simulation of the thermal characteristics of key components of high-speed stamping equipment are illustrated. The force applying mechanism of high-speed stamping equipment is mainly composed of main shaft, connecting rod, upper beam, slider, bearing and so on. figure 2 It is a 1 / 2 simplified symmetrical structure diagram of the force application mechanism of the corresponding high-speed stamping equipment of the present invention. The simulation method is as follows:
[0029] 1) Heat source analysis and calorific va...
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The invention discloses a cross-scale simulation method for a thermal-state characteristic of a key part of a high-speed stamping device. The method comprises the steps of firstly, determining a main heat source and a heating value of the main heat source for the key part of the high-speed stamping device in a working process; secondly, determining a heat transfer path and a heat transfer way which influence temperature field distribution of the key part, and calculating a convection heat exchange coefficient; thirdly, obtaining a fractal dimension and a characteristic length of a solid rough surface of the key part, simulating the solid rough surface, comprehensively considering three different deformation mechanisms of elasticity, plasticity and elastoplasticity, and computing contact heat resistance to obtain contact heat transfer coefficients of various solid contact surfaces; and finally, performing finite element simulation analysis on the thermal-state characteristic of the key part of the high-speed stamping device. According to the method, multiple deformation mechanisms are considered and deformation is divided into three conditions for computing matrix heat resistance under the condition of considering a dynamic friction factor, so that the simulation method can analyze the thermal-state characteristic of the key part of the high-speed stamping device more comprehensively and accurately, and the actual condition is better met.
Description
technical field [0001] The invention relates to the technical field of high-speed stamping, in particular to a cross-scale simulation method for thermal characteristics of key components of high-speed stamping equipment. Background technique [0002] There are mainly test methods and simulation methods for the analysis of thermal characteristics of key components of high-speed stamping equipment. The test method requires a large number of experiments to complete the measurement of the temperature field of the whole machine. When collecting temperature information, it is impossible to arrange sensors on the whole machine, but usually in some parts of the stamping equipment. The position of the sensor directly affects the accurate collection of temperature information. , which ultimately affects the accuracy of the thermal analysis model. In addition, the test method requires more equipment, is more expensive, and is not universal. The simulation method uses the existing fin...
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IPC IPC(8): G06F17/50
CPCG06F30/23G06F2119/08Y02E60/00
Inventor 程锦周振栋林志强冯毅雄刘振宇谭建荣
Owner ZHEJIANG UNIV