Heat dissipation for substrate assemblies

Abstract

Various embodiments described herein include systems, methods and / or devices used to dissipate heat generated by electronic components in an electronic system (e.g., a memory system that includes closely spaced memory modules). In one aspect, an electronic system (100) includes a substrate (206), at least one electronic component (212), and a heat sink (214). The at least one electronic component (212) is mechanically coupled to the substrate (206) and thermally coupled to a ground plane (210) of the substrate (206), such that heat generated by the at least one electronic component (212) is dissipated at least partially to the ground plane (210) of the substrate. The heat sink (214) is mechanically coupled to an edge of the substrate (206), and thermally coupled to the ground plane (210) of the substrate to at least partially dissipate the heat generated by the at least one electronic component (212). In some embodiments, the heat sink further includes an attachment structure (216), a tab (218) and a plurality of heat dissipaters (220).

Description

technical field [0001] The disclosed embodiments relate generally to heat dissipation and, more particularly, to dissipating heat generated by electronic components in electronic systems. Background technique [0002] Many electronic systems include semiconductor memory modules, such as solid state drives (SSDs), dual inline memory modules (DIMMs), and small outline DIMMs, all of which utilize memory cells to store data as electrical charges or voltages. Improvements in the storage density of these modules have been achieved by using enhanced manufacturing techniques to increase the density of memory cells on each individual memory component. Furthermore, the storage density of these modules has also been increased by using advanced board-level packaging techniques to allow each memory device or module to include more memory components. However, as the storage density increases, the total heat generated by the modules also increases. This heat generation is especially prob...

AI Technical Summary

Problems solved by technology

However, in view of the increasingly compact form factors of memory modules, the combined cooling effect of heat sinks and airflow is often insufficient

As a result, larger cooling systems and / or fans running at higher speeds are generally required, resulting in a noisy, inefficient, and costly system that does not adequately address non-uniform heat dissipation across each memory module

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