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Packaging material for electronic product and preparation method of packaging material

A technology for packaging materials and electronic products, applied in the field of packaging, can solve problems such as performance crossover and storage constraints, and achieve the effects of improving adaptability and toughness, widening use space, and improving tear strength and elongation at break.

Inactive Publication Date: 2016-08-24
SUZHOU JIN TENG ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When used in the packaging of electronic products, the requirements for the ductility and tear resistance of the outer packaging materials of electronic products are relatively high. If the performance is poor, it will greatly restrict the preservation of electronic products in the packaging materials.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Step 1: Take 40 parts of polyvinyl chloride, 2 parts of polyethylene terephthalate, 7 parts of polyethylene glycol diacrylate, 5 parts of polyfluoroethylene propylene, and starch octenyl succinate by weight. 1 part, 6 parts of styrene-butadiene rubber, 2 parts of polyaspartic acid ester polyurea resin, 9 parts of polyvinyl alcohol phthalate, 5 parts of polyethylene glycol succinate, the above-mentioned ingredients in Stir at 120°C for 40 minutes;

[0034] Step 2: Extrude the material stirred in step 1 with a twin-screw extruder. The head temperature of the twin-screw extruder is 160°C. ℃, the temperature in the second zone is 175 ℃, the temperature in the third zone is 200 ℃, the temperature in the fourth zone is 210 ℃, granulate after extrusion;

[0035] Step 3: The granulated material is calendered, cooled, and prepared as a packaging material for electronic products.

Embodiment 2

[0037] Step 1: Take 20 parts of polyvinyl chloride, 5 parts of polyethylene terephthalate, 3 parts of polyethylene glycol diacrylate, 2 parts of polyfluoroethylene propylene, and starch octenyl succinate by weight. 4 parts, 3 parts of styrene-butadiene rubber, 6 parts of polyaspartate polyurea resin, 3 parts of polyvinyl alcohol phthalate, 2 parts of polyethylene glycol succinate, the above ingredients in Stir at 110°C for 20 minutes;

[0038] Step 2: Extrude the material stirred in step 1 with a twin-screw extruder. The head temperature of the twin-screw extruder is 150°C. ℃, the temperature in the second zone is 185 ℃, the temperature in the third zone is 190 ℃, the temperature in the fourth zone is 205 ℃, granulate after extrusion;

[0039] Step 3: The granulated material is calendered, cooled, and prepared as a packaging material for electronic products.

Embodiment 3

[0041] Step 1: Take 25 parts of polyvinyl chloride, 4 parts of polyethylene terephthalate, 4 parts of polyethylene glycol diacrylate, 4 parts of polyfluoroethylene propylene, and starch octenyl succinate by weight. 3 parts, 4 parts of styrene-butadiene rubber, 5 parts of polyaspartate polyurea resin, 4 parts of polyvinyl alcohol phthalate, 3 parts of polyethylene glycol succinate, the above ingredients in Stir at 120°C for 40 minutes;

[0042] Step 2: Extrude the material stirred in step 1 with a twin-screw extruder. The head temperature of the twin-screw extruder is 160°C. ℃, the temperature in the second zone is 175 ℃, the temperature in the third zone is 200 ℃, the temperature in the fourth zone is 210 ℃, granulate after extrusion;

[0043] Step 3: The granulated material is calendered, cooled, and prepared as a packaging material for electronic products.

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PUM

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Abstract

The invention belongs to the field of packaging materials, and discloses a packaging material for an electronic product and a preparation method of the packaging material. The preparation method comprises the following steps that 1, polyvinyl chloride, polyethylene glycol terephthalate, Polyethylene glycol 200 diacrylate, fluorinated ethylene-propylene, octenyl succinic acid modified starch, styrene-butadiene rubber, polyarylether, poly(vinyl alcohol)phthalate and polyethylene glycol succinate are taken by weight and are stirred; 2, the material stirred in the step 1 is extruded through a double-screw extruder, and pelleting is carried out after extruding; 3, the pelleted material is rolled and molded, and after cooling, the material is prepared into the packaging material for the electronic product. The prepared packaging material has very good tearing strength and elongation at break, and has very good prospects when used for sealing, dust prevention and dampness prevention of the electronic product.

Description

technical field [0001] The invention belongs to the field of packaging, and relates to a packaging material for electronic products and a preparation method thereof. Background technique [0002] Packaging materials refer to the materials used to make packaging containers, packaging decoration, packaging printing, packaging and transportation to meet product packaging requirements, including metal, plastic, glass, ceramics, paper, bamboo, wild mushrooms, natural fibers, Main packaging materials such as chemical fibers and composite materials, and auxiliary materials such as coatings, adhesives, strapping tapes, decorations, and printing materials. Polyvinyl chloride is widely used. In terms of packaging materials, it can manufacture packaging films, shrink films, composite films and transparent sheets, as well as containers and turnover boxes, as well as packaging coatings. When used in the packaging of electronic products, the requirements for the ductility and tear resis...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L27/06C08L67/02C08L35/02C08L9/06C08L3/06C08L75/02B29C47/92B29C48/92
CPCC08L27/06B29C48/92B29C2948/92704C08L2205/025C08L2205/035C08L67/02C08L35/02C08L9/06C08L3/06C08L75/02
Inventor 孙政良
Owner SUZHOU JIN TENG ELECTRONICS TECH
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