Method of making reinforced metal hole
A technology for strengthening metal and seed layers, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as low production efficiency, high cost, and easy to produce deviations, so as to improve production efficiency, save costs, and simplify the process Effect
Inactive Publication Date: 2016-08-31
THE 41ST INST OF CHINA ELECTRONICS TECH GRP
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Problems solved by technology
It is necessary to make an additional mask and use a photolithography machine to make reinforced metallized holes, and deviations are likely to occur when the mask pattern and the through hole on the substrate are aligned, resulting in low production efficiency and high cost
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[0044] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0045] The invention provides a method for making reinforced metallized holes, the method has simple process, does not need a mask plate and a photolithography machine, and there is no alignment deviation between the photoresist pattern and the through hole, thereby improving production efficiency and saving costs .
[0046] Such as figure 1 As shown, the method for making reinforced metallized holes of the present invention specifically comprises the followi...
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Abstract
The invention provides a method of making a reinforced metal hole. The method comprises the following steps: (101) a through hole is processed in a substrate; (102) seed layers are sputtered on the front side and the back side of the substrate; (103) a photoresist is applied from the front side of the substrate; (104) the side, with the photoresist, of the substrate faces downwardly and obliquely and is rotated along a rotation shaft vertical with the oblique side under vertical irradiation of ultraviolet light and exposed; (105) one side, with the photoresist, of the substrate faces downwardly and is placed horizontally, and the side is tightly contacted with a reflector panel and is then exposed under vertical irradiation of ultraviolet light; (106) development is carried out; (107) electroplating is carried out; and (108) the photoresist is removed. According to the method of making the reinforced metal hole, no extra mask needs to be made, no photoetching machine is needed, and the method has the advantages of simple process and low cost.
Description
technical field [0001] The invention relates to the field of thin film circuits, in particular to a method for making reinforced metallized holes. Background technique [0002] Thin film circuits are passive networks made on substrates by sputtering, evaporation, photolithography, electroplating and other processing techniques. Compared with thick-film circuits, thin-film circuits have higher dimensional accuracy; compared with monolithic integrated circuits, thin-film circuits are easier to design and process, and easier to assemble and debug. Based on the above characteristics, thin film circuits are widely used in the microwave field. [0003] In the design and processing of thin film circuits, metallized holes are often used for grounding. Metallized holes can reduce the resistance and inductance, and improve the technical indicators of the circuit. [0004] The main steps of making a thin film circuit with metallized holes include: processing through holes, depositin...
Claims
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Login to View More IPC IPC(8): H01L21/768
CPCH01L21/76838
Inventor 宋振国路波王斌曹乾涛胡莹璐赵海轮付延新桑锦正
Owner THE 41ST INST OF CHINA ELECTRONICS TECH GRP