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A kind of LED encapsulation structure and the lamp string structure formed thereof

A technology of LED packaging and LED chips, applied in lighting devices, lighting and heating equipment, electrical components, etc., can solve problems such as inability to replace, work, and package failure, and achieve the effect of simple and easy replacement.

Active Publication Date: 2018-02-13
SHENZHEN LEDMY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This kind of packaging structure, once a LED chip in the package is damaged, it cannot be replaced, and a series of series connection will lead to the failure of the entire package and cannot work

Method used

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  • A kind of LED encapsulation structure and the lamp string structure formed thereof
  • A kind of LED encapsulation structure and the lamp string structure formed thereof
  • A kind of LED encapsulation structure and the lamp string structure formed thereof

Examples

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Embodiment Construction

[0024] see Figure 1-4 , the LED packaging structure of the present invention is a 360-degree light-emitting structure, the fluorescent glass plate 1 is a rigid transparent substrate, and contains corresponding fluorescent particles, and the two LED chips 2 are respectively located on the upper side and the lower side of the fluorescent glass plate 1, and the two chips There are two lead-out electrodes 9 respectively, and the two LED chips 2 and the fluorescent glass plate 1 are covered with fluorescent glue 3, and are formed into a cube shape or a cuboid shape through cutting and polishing processes, and at the corresponding positions of the four electrodes 9 There are four connection holes 4, the four connection holes 4 are filled with transparent conductive material, there are four relatively shallow shallow grooves 5 on the surface of the fluorescent glue facing the two LED chips 2, the shallow grooves 5 It is also filled with transparent conductive material, and is electr...

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PUM

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Abstract

The invention relates to an LED packaging structure having transparent conductive material. The transparent conductive material comprises a first portion filling connecting holes and shallow trenches, a second portion partially filling deep trenches, and a third portion projecting from a second side opposite to the deep trenches, and has a first conductive path including the second portion and the first portion to connect third and third electrodes and a second conductive path including the third portion and the first portion to connect second and fourth electrodes; the projecting third portion match in shape with concave portions of the deep trenches not filled with the transparent conductive material. The LED packaging structure enables a lamp string with multiple LED chips in series and parallel connection and is easy to replace, and a method is simple.

Description

technical field [0001] The invention relates to the field of solid-state lighting materials, in particular to an LED package structure and a light string structure formed therefrom. Background technique [0002] LED is a solid-state semiconductor device that can directly convert electrical energy into light energy. Compared with traditional incandescent lamps and fluorescent lamps, white LEDs have the advantages of low power consumption, high luminous efficiency, long service life, energy saving and environmental protection, so they can not only be widely used in the field of daily lighting, but also enter the field of display equipment. [0003] The current LED packaging is mainly a COB (chip on board) packaging structure. This kind of packaging mostly fixes multiple LED chips on the substrate, connects them in series and parallel through wire bonding, and then performs overall sealing with resin. In this kind of package structure, once an LED chip in the package is damage...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/52H01L33/50H01L33/62H01L25/075F21S4/00
CPCF21S4/00H01L25/0756H01L33/505H01L33/52H01L33/62
Inventor 袁汝平
Owner SHENZHEN LEDMY
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