A kind of automatic production method of semiconductor

Abstract

The invention discloses an automatic production method for a semiconductor for use in controlling a technical process of an automatic semiconductor welding device that comprises a tray mechanism, a loading and unloading platform capable of picking up workpieces, a preheating transfer table capable of heating workpieces, and a rotatable welding fixture for fixing workpieces. A switching manipulator, which is capable of picking up or placing workpieces on the preheating transfer table and the welding fixture simultaneously, is disposed between the preheating transfer table and the welding fixture. The automatic production method for a semiconductor comprises the following steps: loading for heating, preheating of workpieces, loading for welding, welding, and unloading. The quality and efficiency of welding are improved by sufficiently preheating workpieces through reasonable use of auxiliary time of loading and unloading, and enabling an additional rotation function of the welding fixture to weld a plurality of work faces of a workpiece without replacing a plurality of fixtures.

Description

technical field [0001] The invention relates to the field of semiconductor processing, in particular to an automatic semiconductor production method. Background technique [0002] A diode is a device made of a semiconductor, and a semiconductor refers to a material whose conductivity at room temperature is between that of a conductor and an insulator. Diodes are widely used in communication, medical, military and other fields. They have the advantages of high efficiency, small size and long life. No matter from the perspective of technology or economic development, the importance of diodes is very huge. At present, in the process of processing diodes, the metal surface to be welded must be preheated first. Preheating can reduce the welding stress and the restraint of the welding structure, which plays an important role in the quality of welding. The welding method in the prior art is to assemble the fixture assembly and the heating module together, and preheat the diode aft...

AI Technical Summary

Problems solved by technology

The welding method in the prior art is to assemble the fixture assembly and the heating module together, and preheat the diode after placing it on the fixture, which makes the diode not fully preheated, thereby affecting the quality of welding. Using this The structure of the heating module, in order to fully preheat the diode, it is necessary to prolong the time for the workpiece to stay on the fixture, resulting in an increase in auxiliary time, especially during batch processing, when the workpiece stays on the fixture for heating, other functional parts of the equipment stop Work, wait for the workpiece to be heated and welded before proceeding to the next step. The welding efficiency is low, so it is necessary to separate the heating time of the workpiece on the fixture, so that the workpiece can be welded as soon as it is placed on the fixture

Moreover, these semiconductor devices have multiple welding surfaces, and the multiple welding surfaces are not on the same plane. Therefore, it is necessary to use different fixtures several times to solder the semiconductor devices, thereby reducing work efficiency and increasing loading and unloading. The number of times, while cooling the semiconductor device, seriously affects the quality of welding

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