Fabrication method of multilayer tunneling junction three-dimensional tunneling field effect transistor
A technology of tunneling field effect and tunneling junction, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc. It can solve the problems of driving current reduction and leakage current reduction, achieve large driving current and increase current channel , the effect of high tunneling junction area
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[0016] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.
[0017] The embodiment of the present invention provides a method for manufacturing a multilayer tunnel junction three-dimensional tunneling field effect transistor, the method including:
[0018] S11. The heavily doped p-type or n-type silicon and the intrinsic or lightly doped silicon overlap each other to form a multilayer surface tunnel junction structure;
[0019] The formed multilayer surface tunnel junction structure is as image 3 As ...
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