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Flexible device and method for making flexible device

A flexible and rigid technology, which is applied in the direction of bendable/stretchable parts of the circuit, printed circuit manufacturing, printed circuit assembly of electrical components, etc., can solve component damage, unsatisfactory production yield, and poor peeling force same problem

Active Publication Date: 2018-10-19
HANNSTAR DISPLAY CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when making electronic components on flexible substrates, the rigidity of the overall device is not uniform, that is, the rigidity of some areas is relatively high, so the peeling force that needs to be applied during mechanical peeling will also be different.
Damage to components may occur in the area where the applied peeling force is large, and the production yield is not ideal

Method used

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  • Flexible device and method for making flexible device
  • Flexible device and method for making flexible device
  • Flexible device and method for making flexible device

Examples

Experimental program
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Embodiment Construction

[0080] Figure 1A It is a schematic top view of a step of the manufacturing method of the flexible device according to the first embodiment of the present invention, Figure 1B for Figure 1A The cross-sectional schematic diagram of the section line A-A, while Figure 1C for Figure 1A A schematic cross-sectional view of the section line B-B. Please refer to Figure 1A to Figure 1C , a flexible substrate 110 can be temporarily attached to a carrier 20 through a release layer 10, wherein the flexible substrate 110 has a first surface 112 and a second surface 114 opposite, and the second The surface 114 is in contact with the release layer 10 . Specifically, the material of the flexible substrate 110 is, for example, polyimide (PI), polycarbonate (polycarbonate, PC), polyethersulfone (polyethersulfone, PES), polyacrylate (polyacrylate, PA), poly Polynorbornene (PNB), polyethylene terephthalate (PET), polyether ether ketone (polyetheretherketone, PEEK), polyethylene naphthalat...

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Abstract

The invention discloses a flexible device and a manufacturing method of the flexible device, wherein the flexible device has a first region and a second region, and part of the rigidity of the first region is greater than that of the second region. The flexible device includes a flexible substrate and a rigid element. The flexible substrate includes a first surface and a second surface opposite to each other, and the second surface of the flexible substrate has a rough structure in the first area, and the surface roughness of the second surface in the first area is greater than that in the second area. Surface roughness. The rigid element is disposed on the first surface of the flexible substrate and located in the first region, wherein the rigidity of the rigid element is greater than that of the flexible substrate and the area of ​​the rough structure projected on the flexible substrate overlaps the area of ​​the rigid element .

Description

technical field [0001] The invention relates to a flexible device and a manufacturing method thereof. Background technique [0002] Flexible devices must use flexible substrates to achieve flexible properties. However, the flexible property of the flexible substrate leads to the problem that electronic components cannot be fabricated directly thereon. In order to make electronic components on flexible substrates, it is necessary to attach the flexible substrates to a hard carrier or machine, so that the carrier or machine can provide proper support, and then form the electronic components on the on a flexible substrate. As such, the flexible substrate needs to be removed from the hard carrier or machine after the electronic components are manufactured. [0003] At present, the flexible substrate can be removed from the carrier after the electronic components are manufactured, and a release layer is used to bond the flexible substrate to the carrier. Then, using a mechani...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K3/30
CPCH05K1/0281H05K3/0032H05K2201/0145H05K2201/0154H05K2201/10106H05K2201/10128H05K2201/2009H05K2203/1178H05K3/007H05K1/028
Inventor 吴政哲蔡镇竹黄建融叶永辉陈恒殷
Owner HANNSTAR DISPLAY CORPORATION