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Karst reservoir broken bead oil pool well point determining method and device

A production method and back-drilling technology, which is applied in the manufacture of printed circuits, the formation of electrical connections of printed components, electrical components, etc., can solve problems such as affecting positioning, PCB size deformation, and the welding ring of the orifice falls off, so as to improve the quality of PCB , prevent poor contact, avoid the effect of debris adhesion

Active Publication Date: 2016-10-12
广州广合科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, the method of drilling twice in a row or directly drilling after the circuit etching is adopted; this method will cause the hole to be severely draped, and the welding ring of the hole will fall off after two consecutive drillings, which will seriously affect the finished PCB rate and performance
In addition, the high temperature generated during drilling can easily cause debris to adhere to the metal layer, which not only makes it difficult to control the drilling depth, but also easily leads to poor contact or short circuit of the residual metal layer in the hole after drilling
In addition, the high temperature during drilling can easily cause PCB size deformation and affect positioning

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] This embodiment provides a method for manufacturing back-drilled holes at the BGA position on the PCB, including steps:

[0024] S1. After cutting the circuit board substrate, pasting the dry film, browning the inner layer and pressing the plate, drill it for the first time;

[0025] S2. Copper sinking electroplating on the whole board, and carrying out outer layer pattern transfer to the laminated board processed by the pressing plate described in step S1 after the copper sinking electroplating, and pattern electroplating copper and tin;

[0026] S3. Perform back drilling on the hole at the BGA position;

[0027] S4. Carry out alkaline etching treatment to the plate after back drilling;

[0028] S5. The PCB board obtained in step S4 is subjected to tin stripping treatment, and the PCB board after the tin stripping treatment is tested by a flying probe tester, and the finished product is obtained after passing the test;

[0029] In the step S3, the holes on the outsid...

Embodiment 2

[0033] This embodiment provides a method for manufacturing back-drilled holes at the BGA position on the PCB, including steps:

[0034] S1. After cutting the circuit board substrate, pasting the dry film, browning the inner layer and pressing the plate, drill it for the first time;

[0035] S2. Copper sinking electroplating on the whole board, and carrying out outer layer pattern transfer to the laminated board processed by the pressing plate described in step S1 after the copper sinking electroplating, and pattern electroplating copper and tin;

[0036] S3. Perform back drilling on the hole at the BGA position;

[0037] S4. Carry out alkaline etching treatment to the plate after back drilling;

[0038] S5. The PCB board obtained in step S4 is subjected to tin stripping treatment, and the PCB board after the tin stripping treatment is tested by a flying probe tester, and the finished product is obtained after passing the test;

[0039] In the step S3, the holes on the outsid...

Embodiment 3

[0047] This embodiment provides a method for manufacturing back-drilled holes at the BGA position on the PCB, including steps:

[0048] S1. After cutting the circuit board substrate, pasting the dry film, browning the inner layer and pressing the plate, drill it for the first time;

[0049] S2. Copper sinking electroplating on the whole board, and carrying out outer layer pattern transfer to the laminated board processed by the pressing plate described in step S1 after the copper sinking electroplating, and pattern electroplating copper and tin;

[0050] S3. Perform back drilling on the hole at the BGA position;

[0051] S4. Carry out alkaline etching treatment to the plate after back drilling;

[0052]S5. The PCB board obtained in step S4 is subjected to tin stripping treatment, and the PCB board after the tin stripping treatment is tested by a flying probe tester, and the finished product is obtained after passing the test;

[0053] In the step S3, the holes on the outside...

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Abstract

The invention provides a karst reservoir broken bead oil pool well point determining method and device. The method comprises the steps that seismic data are used to identify an oil source fault from a karst reservoir to a source rock; the developmental interval of the karst reservoir and the distribution law of the developmental interval of the karst reservoir are determined; according to the distribution law and the seismic data, a number of fractured cavities which are communicated with the oil source fault are selected from the development interval of the karst reservoir; a seismic inversion method is used to carry out hydrocarbon detection on substances in the fractured cavities; the fractured cavities containing crude oil are used as broken bead oil pools; according to the distribution law and the seismic data, the oil pool size of the broken bead oil pools is determined; and according to the oil pool size of the broken bead oil pools, oil pool mining well points are determined. According to the invention, karst reservoir broken bead oil pool well points can be quickly and efficiently disposed.

Description

technical field [0001] The present invention relates to the technical field of circuit board machining, and specifically relates to a manufacturing method for back-drilling a BGA position on a PCB. Background technique [0002] The BGA area on the PCB (printed circuit board) is provided with an array of metallized holes. In order to achieve the shielding effect of the BGA area, a part of the metal layer in the hole needs to be removed. In the prior art, the method of drilling twice in a row or directly drilling after the circuit etching is adopted; this method will cause the hole to be severely draped, and the welding ring of the hole will fall off after two consecutive drillings, which will seriously affect the finished PCB rate and performance. In addition, the high temperature generated during drilling can easily cause debris to adhere to the metal layer, which not only makes it difficult to control the drilling depth, but also easily leads to poor contact or short circu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/42
CPCH05K3/0047H05K3/423H05K2203/0779H05K2203/16
Inventor 韩明曾红黎钦源王峻
Owner 广州广合科技股份有限公司
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