Graphene heat conducting agent of computer CPU (Central Processing Unit) chip heat radiator

Abstract

The invention provides a graphene heat conducting agent of a computer CPU (Central Processing Unit) chip heat radiator. The graphene heat conducting agent is prepared from the following components in parts by weight: 25-40 parts of heat conducting silica gel, 2-8 parts of graphene, 1-5 parts of a silane coupling agent, 1-5 parts of polyethylene wax, 2-4 parts of polyacrylamide, 1-3 parts of sodium silicate, 5-8 parts of aluminum nitride, 6-10 parts of zinc oxide and 3-5 parts of silver powder. By adopting a reasonable component ratio and compounding the heat conducting silica gel and the graphene, the thermal conductivity coefficient is high and the heat conduction and heat dissipation effects are good; the use amount of fillers is reasonably utilized and the heat resistance is relatively low; the graphene heat conducting agent has good coating and spreading performances; and meanwhile, the insulating performance of the material is guaranteed.

Description

technical field [0001] The invention belongs to the technical field of heat-conducting agents for radiators of electronic devices, and in particular relates to a graphene heat-conducting agent for computer CPU chip radiators. Background technique [0002] With the high power and high integration of integrated circuits, the assembly density of electronic components continues to increase and the geometric size of equipment continues to shrink, and its energy consumption output has increased sharply. Therefore, in order to ensure the reliability and long service life of sensitive devices, the research on thermally conductive insulating materials that can discharge the heat generated by heating electronic components in time is becoming more and more important. [0003] At present, the heat dissipation and heat conduction of the CPU used in computers are achieved through the following methods. The heat transfer between the heat sink and the CPU is mainly realized through the dire...

AI Technical Summary

Problems solved by technology

A thermally conductive agent with excellent comprehensive performance not only needs to have a high thermal conductivity, but also must have a low thermal impedance. However, at present, too many thermally conductive fillers are used in the industry, which leads to an increase in the viscosity of the thermally conductive agent, and a decrease in coating and paving performance. Increased contact thermal resistance during use