Multi-layer thin-film coatings for system-in-package assemblies in portable electronic devices

An electronic device, multi-layer film technology, applied in the field of interference mitigation, can solve the problems of poor adhesion, degradation or discoloration, and unattractive aesthetics of the underlying layer

Active Publication Date: 2016-10-26
APPLE INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, thin-film metal layers may have limited shielding effectiveness and poor adhesion to underlying layers, which may be aesthetically unappealing and may be prone to environmentally induced degradation or discoloration

Method used

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  • Multi-layer thin-film coatings for system-in-package assemblies in portable electronic devices
  • Multi-layer thin-film coatings for system-in-package assemblies in portable electronic devices
  • Multi-layer thin-film coatings for system-in-package assemblies in portable electronic devices

Examples

Experimental program
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Embodiment Construction

[0016] In the following description of the examples, reference is made to the accompanying drawings, in which are shown by way of illustrations specific examples that may be practiced. It is to be understood that other examples may be utilized and structural changes may be made without departing from the scope of the various examples.

[0017] The present invention relates to multilayer thin film coatings for electrical, mechanical and optical components and subsystems in portable electronic devices assembled using system-in-package (SiP) technology. The multilayer thin film coating can be used for radio frequency shielding and / or magnetic shielding. The multilayer thin film coating can shield components such as integrated circuits (eg, transceiver integrated circuits, memory circuits, and other circuits) that operate in radio frequency bands. Components may also include circuits formed from one or more discrete components such as inductors, capacitors, resistors, switches, a...

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PUM

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Abstract

A portable electronic device (600) packaged into a System- in-Package assembly is disclosed. The portable electronic device can include a substrate (614) and a plurality of components (601-604) mounted on the substrate and included in one or more subsystems. Interference between subsystems or from external sources can be reduced or eliminated by disposing an insulating layer (616) over the components, forming narrow trenches (630) between subsystems, and depositing one or more layers of a multi-layer thin film stack (640, 642, 644, 646) on the insulating layer and filling the trenches. In some examples, the multi-layer thin film stack can include an adhesion layer (640), a shielding layer (642), a protection layer (644), and a cosmetic layer (646). In some examples, the multi-layer thin film stack can include multi-functional layers such as a protection and cosmetic layer.

Description

technical field [0001] The present invention relates generally to interference mitigation, and more particularly to helping provide electromagnetic shielding, adhesion to underlying layers, enhanced aesthetics, and resistance to degradation or discoloration in system-in-package assemblies in compact portable electronic devices. Background technique [0002] Compact portable electronic devices are becoming more and more popular. Examples of compact portable electronic devices include laptop computers, tablet computing devices, cellular phones, media players, gaming devices, handheld devices, miniature devices such as pendant devices and wearable devices, and other devices. It is generally desirable to reduce both internal and external interference of components in compact portable electronic devices. Electromagnetic shielding can be used to reduce or eliminate interference. For example, some electronic devices include radio frequency transceiver circuits that are susceptibl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28H05K1/02H05K9/00
CPCH05K1/0218H05K9/00H05K2201/09972H05K2201/10371H05K2203/1322H01L2924/3025Y10T29/49146H05K1/0216H05K3/284H05K1/18H05K3/30H05K9/0081H05K2201/0715
Inventor 陈延锋S·S·潘纳瑟尔
Owner APPLE INC
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