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Temperature sensitive adhesive

A heat-sensitive, adhesive technology, applied in the direction of adhesive types, ester copolymer adhesives, adhesives, etc., can solve the problems of unstable balance between the adhesion and peelability of heat-sensitive adhesive tapes, and achieve a balanced Excellent performance and cost reduction effect

Active Publication Date: 2016-11-09
NITTA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, when the ratio of the reactive polysiloxane compound is increased, the balance of adhesiveness and peelability of the heat-sensitive adhesive tape may become unstable.

Method used

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  • Temperature sensitive adhesive
  • Temperature sensitive adhesive
  • Temperature sensitive adhesive

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0064] 45 parts of behenyl acrylate produced by Eri Oil Co., Ltd., 49 parts of methyl acrylate produced by Nippon Shokubai Co., Ltd., 5 parts of acrylic acid, 1 part of modified polydimethylsiloxane compound, and as a polymerization initiator 0.2 parts of "PerbutylND" manufactured by NOF Corporation was added to 230 parts of ethyl acetate, mixed, stirred at 55° C. for 4 hours, and these monomers were polymerized. The obtained copolymer had a weight average molecular weight of 580,000 and a melting point of 56°C. In addition, the modified polydimethylsiloxane compound used is as follows.

[0065] Modified polydimethylsiloxane compound: Shin-Etsu Chemical Co., Ltd.'s single-end reactive silicone oil "KF-2012" represented by the above general formula (II)

Synthetic example 2

[0067] Except that 45 parts of behenyl acrylate, 46 parts of methyl acrylate, 5 parts of acrylic acid, and 4 parts of modified polydimethylsiloxane compounds are used, the rest are carried out in the same manner as in Synthesis Example 1. These monomers polymerize. The obtained copolymer had a weight average molecular weight of 630,000 and a melting point of 55°C.

Synthetic example 3

[0069] Except that 45 parts of behenyl acrylate, 45 parts of methyl acrylate, 5 parts of acrylic acid, and 5 parts of modified polydimethylsiloxane compound are carried out in the same manner as in Synthesis Example 1. These monomers polymerize. The obtained copolymer had a weight average molecular weight of 600,000 and a melting point of 55°C.

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Abstract

This temperature sensitive adhesive includes a side chain crystalline polymer obtained by polymerizing (meth)acrylate having a straight chain alkyl group with at least 16 carbon atoms, and adhesion of the temperature sensitive adhesive decreases at a temperature less than the melting point of the side chain crystalline polymer. The side chain crystalline polymer is composed of a copolymer obtained by further polymerizing a reactive polysiloxane compound, and the ratio of the (meth)acrylate having a straight chain alkyl group with at least 16 carbon atoms to the reactive polysiloxane compound is (meth)acrylate having a straight chain alkyl group with at least 16 carbon atoms:reactive polysiloxane compound=91:9 to 99:1, by weight.

Description

technical field [0001] The present invention is a heat-sensitive adhesive capable of reversibly controlling adhesive force by heat. Background technique [0002] A heat-sensitive adhesive is a heat-sensitive adhesive whose adhesive force can be reversibly controlled by heat. More specifically, when the heat-sensitive adhesive is cooled to a temperature lower than the melting point of the side-chain crystalline polymer contained as a main component, the adhesive force decreases due to crystallization of the side-chain crystalline polymer. [0003] A heat-sensitive adhesive tape, which is one form of use of a heat-sensitive adhesive, is used in the production of ceramic members such as laminated ceramic capacitors (for example, refer to Patent Document 1). In the production of ceramic components, heat-sensitive adhesive tapes are used for temporary fixing of components. It is desirable that the heat-sensitive adhesive tape used for such an application be a heat-sensitive adh...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J133/14C09J7/02C09J143/04C09J183/07H01G4/12H01G4/30C09J7/22C09J7/35
CPCC09J143/04H01G4/30H01G4/12C09J4/00C09J133/00C09J2203/326C09J2433/00C08G77/442C09J183/10C09J7/35C09J7/22C08L83/04H01G4/308C08F220/1808C08F220/1818C09J2203/33C09J133/06C09J183/04C08F220/18C09J7/255
Inventor 佐古圭辅河原伸一郎
Owner NITTA CORP