A capping device for capping a semiconductor laser and its working method
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- 潍坊华光光电子有限公司
- Publication Date
- 2018-11-09
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Abstract
Description
technical field
[0001] The invention relates to a capping device for capping a semiconductor laser and a working method thereof, belonging to the technical field of laser packaging. Background technique
[0002] In the 1970s, the success of room temperature continuous oscillation of semiconductor lasers and the realization of low-loss optical fibers opened the prelude to the era of optoelectronics. Due to the advantages of small size, light weight, high efficiency, long life, easy modulation and low price, semiconductor lasers have been widely used in industry, medicine and military fields. This also promotes the industrialization of semiconductor lasers, but in the production process, semiconductor lasers are prone to touch the light-emitting surface, resulting in three types of failures: early failure, accidental failure, and loss failure.
[0003] The internal chip is an important part of the semiconductor laser. The internal chip is expensive, the material is special, a...