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A kind of polytetrafluoroethylene dielectric circuit board manufacturing method of multilayer dielectric circuit

A technology for manufacturing polytetrafluoroethylene and circuit boards, which is applied in multilayer circuit manufacturing, printed circuit manufacturing, printed circuit, etc., to improve surface roughness and realize interlayer bonding problems

Active Publication Date: 2018-12-25
南京欣达飞科技股份有限公司
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Problems solved by technology

[0003] The purpose of the present invention is to provide a polytetrafluoroethylene dielectric circuit board manufacturing method for multilayer dielectric circuits, to solve the problem of multilayer compounding of polytetrafluoroethylene resin media and polytetrafluoroethylene resin media and to realize the interconnection of multilayer dielectric circuits The problem

Method used

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  • A kind of polytetrafluoroethylene dielectric circuit board manufacturing method of multilayer dielectric circuit

Examples

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Embodiment 1

[0019] Example 1 as figure 1 Shown, a polytetrafluoroethylene dielectric circuit board manufacturing method of a multilayer dielectric circuit comprises the steps:

[0020] Step (1), select two PTFE resin double panels;

[0021] Step (2), bake the first PTFE resin double-sided board, CNC drilling, plasma technology treatment, hole metallization, and realize the first side and the second PTFE double-sided board of the first PTFE resin Two-sided interconnection, as attached figure 1 In the K1-2 interconnection, the inner layer circuit pattern is made on the second side of the first polytetrafluoroethylene resin double-sided board; the process of making the inner layer circuit pattern is: pattern transfer, copper plating on the hole, pattern transfer , Hole electroplating and etching graphics;

[0022] Step (3), bake the second PTFE resin double-sided panel, CNC drilling, plasma treatment, and metallization of the hole to realize the first and second sides of the second PTFE r...

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Abstract

The invention discloses a manufacturing method of a polytetrafluoroethylene dielectric circuit board with multilayered dielectric circuits. A thermoplastic resin adhesive sheet which refers to a 3001 adhesive sheet from the ROGERS company is adopted; the optimized lamination technological parameters are selected; on the basis of plasma treatment equipment and process control, the interlamination firm combination of two pieces of polytetrafluoroethylene resin two-sided plates is successfully realized; and under the assistance of a plasma activation treatment condition, and by combination of plated through hole and related pattern manufacturing, the multilayered pure polytetrafluoroethylene dielectric circuit board used for communication is obtained.

Description

technical field [0001] The invention relates to a manufacturing technology for a composite dielectric circuit board of a multilayer dielectric circuit, in particular to a method for manufacturing a polytetrafluoroethylene dielectric circuit board for a multilayer dielectric circuit. Background technique [0002] In today's electronics industry, the substrate medium commonly used in the manufacture of printed multilayer circuits is the epoxy resin system. After decades of hard work, it is relatively mature. Among all resin systems, polytetrafluoroethylene resin is the first choice in microwave communication due to its minimum dielectric constant and positive dielectric loss angle, as well as its susceptibility to high and low temperature and aging, and it is gradually becoming more and more popular in microwave communication. layer circuit design goals. For this reason, the multilayer adhesion problem in the manufacture of multilayer circuits must be solved. Although thermo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46
CPCH05K3/4623H05K2203/061
Inventor 严凯
Owner 南京欣达飞科技股份有限公司
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