Gravity pressurization and automatic mechanical pressurization integrated grinding and polishing machine

Abstract

The invention relates to a grinding and polishing machine, in particular to a gravity pressurization and automatic mechanical pressurization integrated grinding and polishing machine. The gravity pressurization and automatic mechanical pressurization integrated grinding and polishing machine comprises a pressure grinding and polishing head and a base machine body; the pressure grinding and polishing head is fixedly connected with the base machine body through an upright column (22); the pressure grinding and polishing head comprises a bottom supporting plate, an upper spindle transmission mechanism, a pressurization transmission mechanism, a specimen fixing mechanism and an upper part fixing seat (8); the base machine body comprises a bottom plate (26), a lower spindle transmission mechanism and a swing mechanism; the bottom supporting plate (1) is a substrate of the entire pressure grinding and polishing head, and others spare parts are fixed on the upper surface of the bottom supporting plate (1); a power supply box of a power motor (2) is fixed to the bottom supporting plate (1); a wiring harness of the power motor is connected with a PLC; the power motor (2) is mounted on the bottom supporting plate (1) through a power motor fixing plate (3); and a driving bevel gear (4) at the output end of the power motor is engaged to a driven bevel gear (5) at a 90-degree angle. The gravity pressurization and automatic mechanical pressurization integrated grinding and polishing machine is applicable to grinding and polishing of metal materials, inorganic non-metal materials, organic high polymer materials and composites.

Description

technical field [0001] The invention relates to a grinding and polishing machine, in particular to a grinding and polishing machine integrating gravity pressure and automatic mechanical pressure. Background technique [0002] Grinding and polishing machines are mainly used in material research and processing and material processing, but different materials have different characteristics, and the pressure requirements for grinding and polishing are also different. Thereby the existing grinding and polishing machine is either used for the grinding and polishing of a certain material sample, such as a silicon carbide wafer grinding and polishing machine, an optical lens polishing machine, etc.; or is used for the grinding and polishing of a certain type of material sample, such as gold Phase sample grinding and polishing machine, ceramic grinding and polishing machine, etc. In addition to the single scope of application, there are also disadvantages that the sample is mainly g...

AI Technical Summary

Problems solved by technology

In addition to the single scope of application, there are also disadvantages that the sample is mainly ground and polished by hand, and the pressure of the grinding an

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