High-temperature diffusion equipment
A high-temperature diffusion and equipment technology, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of easy heat loss and insufficient stability, achieve ideal processing effects, improve work efficiency and product quality, and increase The effect of service life
Active Publication Date: 2016-11-23
高唐融知融智科技服务有限公司
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[0003] The purpose of the present invention is to provide a high-temperature diffusion device to solve the problems of high-temperature diffusion devices currently on the market that are not stable enough during processing and easy to lose heat, etc. proposed by the above-mentioned background technology
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[0012] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0013] see figure 1 , the present invention provides a technical solution: a high-temperature diffusion device, including a device main body 1, a high-temperature heating tube 2, a heating wire 3, an air pump 4, a quartz air inlet 5, a silicon chip placement groove 11, a quartz air outlet 13 and An air outlet 14, an electrical control box 7 is fixed below the equipment main body 1, an insulation layer 6 is arranged around the inside of the equipment main body ...
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The invention discloses high-temperature diffusion equipment. The high-temperature diffusion equipment comprises an equipment main body, a high-temperature heating pipe, a heating wire, a suction pump, a quartz gas inlet hole, a silicon sheet storage groove, a quartz gas outlet hole and a gas outlet hole; heat insulation layers are arranged at the outer part of the high-temperature heating pipe; the high-temperature heating pipe is mounted at the outer part of the heating wire; the lower side of the suction pump is connected with an electric appliance control box; a heat dissipation fan is arranged at the left side of a heat dissipation hole; the equipment main body is mounted above the heat dissipation fan; the left side of a crystal boat is connected with a crystal boat fixing frame; the crystal boat is mounted at the outer part of the silicon sheet storage groove. The heat dissipation hole and the heat dissipation fan are arranged at the bottom of the high-temperature diffusion equipment; the heating wire needs to be heated to a very high temperature, so that an electric appliance correspondingly generates a lot of heat; the heat dissipation hole and the heat dissipation fan can be used for discharging the heat generated by the electric appliance in time so that the service life of the equipment is prolonged; the heat insulation layers are arranged at four sides in the equipment main body so that the heat in the equipment is prevented from losing to a certain extent and energy sources are saved.
Description
technical field [0001] The invention relates to the technical field of semiconductor production equipment, in particular to high-temperature diffusion equipment. Background technique [0002] With the prosperity of the economy, the continuous improvement of people's living standards, the development of production technology is getting better and better, and people's use of their time is becoming more and more demanding. In life, we have higher and higher requirements for equipment. We hope to be able to Through the innovation of equipment to improve the working efficiency of the equipment, reduce the working time, improve the efficiency of use, so that it can maximize its value. With the development of science and technology, the application of semiconductors is becoming more and more extensive, mainly made of special functions. Components and devices, such as transistors, integrated circuits, rectifiers, lasers and various photodetectors and microwave devices, etc., the dev...
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IPC IPC(8): H01L21/67
CPCH01L21/6719H01L21/67207
Inventor 孙显强
Owner 高唐融知融智科技服务有限公司