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Dielectric layer for circuit substrate

A circuit substrate and dielectric layer technology, applied to circuit substrate materials, printed circuit components, etc., can solve the problems of poor hole shape, time-consuming, and low absorption rate of transparent glass fibers, etc., to improve efficiency Effect

Inactive Publication Date: 2016-11-23
UNIMICRON TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the process of forming holes in the dielectric layer by means of laser drilling, since the transparent glass fiber has a low absorption rate of laser light, the formed holes are prone to the problem of poor hole shape, and It is also easy to cause the opening process to take more time

Method used

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  • Dielectric layer for circuit substrate

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Embodiment Construction

[0020] figure 1 It is a schematic cross-sectional view of a dielectric layer according to an embodiment of the present invention. Please refer to figure 1 , the dielectric layer 100 includes a resin matrix 102 and glass fibers 104 . The material of the resin matrix 102 is, for example, epoxy. The glass fibers 104 are arranged in the resin matrix 102 in a manner of interlacing each other. In one embodiment, the dielectric layer 100 can be formed by immersing the glass fibers 104 in a liquid resin material and then curing the liquid resin material. In this way, the glass fibers 104 can be uniformly distributed in the cured resin material (resin matrix 102 ).

[0021] In this embodiment, the laser light absorption rate of the glass fiber 104 is greater than that of the transparent glass fiber. In detail, in the commonly used dielectric layer, the glass fibers used are all transparent glass fibers. Since the glass fiber is transparent, due to its low absorption rate for lase...

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Abstract

The invention provides a dielectric layer for a circuit substrate. The dielectric layer comprises resin matrix and a glass fiber, wherein the glass fiber is arranged in the resin matrix; and the laser light absorptivity of the glass fiber is greater than that of a transparent glass fiber, so that the efficiency of the laser drilling process can be effectively improved; and an opening formed in the dielectric layer has a relatively good opening shape.

Description

technical field [0001] The invention relates to a dielectric layer used for circuit substrates, in particular to a dielectric layer containing glass fibers with high absorption rate for laser light. Background technique [0002] In the general circuit board manufacturing process, laser drilling or mechanical drilling is usually used to form openings in the dielectric layer on which the conductive layer is disposed, and then fill the openings with conductive materials, and then The conductive layer is patterned to form a circuit layer on the dielectric layer. Afterwards, a build-up process is performed to form a circuit board with a desired circuit structure. [0003] Generally, the dielectric layer is composed of a resin matrix and transparent glass fibers disposed in the resin matrix. However, in the process of forming holes in the dielectric layer by means of laser drilling, since the transparent glass fiber has a low absorption rate of laser light, the formed holes are ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/03
Inventor 王音统
Owner UNIMICRON TECH CORP