Glue
A technology of glue and urea-formaldehyde resin, used in the field of household glue, can solve the problems of inability to heat-press curing, inability to spray glue, low solid content, etc., and achieve the effects of good machinability, excellent bonding strength and nail holding force.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0011] A glue comprising urea-formaldehyde resin, polyimide, ethacrylate and polyurethane in a weight ratio of 3:2:2.5:4.
[0012] Mix urea-formaldehyde resin, polyimide, ethyl acrylate and polyurethane in proportion, and stir and mix at 70°C to form a paste.
Embodiment 2
[0014] A glue comprising urea-formaldehyde resin, polyimide, ethacrylate and polyurethane in a weight ratio of 4:1:3:2.
[0015] Mix urea-formaldehyde resin, polyimide, ethyl acrylate and polyurethane in proportion, and stir and mix at 50°C to form a paste.
Embodiment 3
[0017] A glue comprising urea-formaldehyde resin, polyimide, ethacrylate and polyurethane in a weight ratio of 2:3:2:6.
[0018] Mix urea-formaldehyde resin, polyimide, ethyl acrylate and polyurethane in proportion, and stir and mix at 60°C to form a paste.
[0019] The characteristic of above-mentioned embodiment product:
[0020] 1. Moderate viscosity, easy to spray.
[0021] 2. Fast curing and high bonding strength.
[0022] 3. It is superior to the traditional particleboard glue process.
[0023] 4. After curing, it has excellent bonding strength, aging resistance, oil and fat resistance
[0024] 5. Cleaning: It is consistent with the traditional urea-formaldehyde resin cleaning method.
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com