A method of soldering and encapsulating inner leads of in-line magnetic components
A technology for soldering packaging and inner pins, applied in electrical components, circuit/collector parts, connections, etc., can solve the problems of unstable product quality, low production efficiency, shortened production process, etc., to save manpower and improve production. Efficiency, the effect of simplifying the production process
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Embodiment 1
[0015] A method for welding and packaging inner leads of an in-line transformer, comprising the following steps:
[0016] (1) The magnetic wire package of the pre-wound enameled wire of the in-line transformer, the grouped enameled lead wire of the magnetic wire package is wound 2 times and fixed on the inner pin of the plastic shell, and then evenly coated with melamine alkyd varnish, passed through the dot The melter injects SL8303 high-temperature resin into the magnetic wire pack, fills and covers the magnetic wire pack, and initially seals and fixes it with the plastic shell. At the same time, leave a length of 1.2mm for the inner pin, and the resin covering thickness is 0.6mm higher than the magnetic wire pack. Curing in air at 100°C for 40 minutes;
[0017] (2) Put (1) the semi-finished product after the initial sealing, with the inner pin facing down, in the pre-designed fixture, and use the dip soldering process to first immerse the inner pin in the water-based no-cle...
Embodiment 2
[0023] A single-in-line inductance component welding and packaging method for inner leads, comprising the following steps:
[0024] (1) The enamelled lead wire of the pre-wound enameled wire of the single-in-line inductive component is wound 3 times on the inner pin of the plastic shell and fixed, and then injects TH-873 epoxy resin through the dispenser In the magnetic wire bag room, fill and cover the magnetic wire bag, and initially seal and fix it with the plastic shell. At the same time, leave a length of 1mm for the inner pin, and the resin covering thickness is 0.5mm higher than the magnetic wire bag. Curing in air at 120°C for 15 minutes;
[0025] (2) Place the semi-finished product after initial sealing in (1) with the inner pin facing down, and place it in a pre-designed fixture. Use the dip soldering process to first immerse the inner pin in rosin-type no-clean flux for 1 second, and then immerse it vertically at a temperature of Dip in lead-free Sn-Cu solder at 410...
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