High-performance heat sink based on directional carbon nanotube thin film and fabrication method of heat sink

A carbon nanotube thin film and carbon nanotube array technology, which is applied in the research and development and application fields of thermal functional devices, can solve the problems of application limitation, large size, high safety performance requirements, etc. Thermal properties, effect of good contact properties

Active Publication Date: 2016-12-07
CHINA ACADEMY OF SPACE TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the size of natural convection cooling devices for water or other fluids is generally large, and their safety performance requirements are very high
However, forced convection heat dissipation devices require forced convection drive equipment and other auxiliary equipment and additional energy consumption, which greatly limits the application in portable electronic devices and other products.

Method used

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  • High-performance heat sink based on directional carbon nanotube thin film and fabrication method of heat sink
  • High-performance heat sink based on directional carbon nanotube thin film and fabrication method of heat sink
  • High-performance heat sink based on directional carbon nanotube thin film and fabrication method of heat sink

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Effect test

Embodiment 1

[0050] Embodiment 1: Heat dissipation performance test of a radiator based on an aligned carbon nanotube film

[0051] Figure 5 The comparison between the heat dissipation performance of the heat dissipation device of the present invention and the heat dissipation performance of common metal copper plates is shown. Under the same heating power (0.42W), the temperature variation and equilibrium temperature of the metal copper plate and the heat dissipation device of the present invention were measured respectively. Under the heating power, the equilibrium temperature of the heat dissipation device of the present invention is about 44.5°C, while the equilibrium temperature of the metal copper plate is about 63.5°C. This shows that the heat dissipation device of this invention has better heat dissipation performance. on the other hand, Figure 5 The temperature change curve in also shows that the cooling device in the present invention has a faster temperature stabilization s...

Embodiment 2

[0052] Embodiment 2: Natural convection heat dissipation performance measurement of a radiator based on an aligned carbon nanotube film

[0053] We can respectively calculate the size of the natural convection heat dissipation coefficient of the pure copper plate and the radiator of this invention according to formulas (1) and (2). Specific results such as Image 6 Shown, under 6 different heating power conditions, the natural convection heat dissipation coefficient size of radiator among the present invention is 37.4-44.2W / (m 2 .K), while the natural convection heat dissipation coefficient of metal copper plate is 19.8-27.9W / (m 2 .K). The natural convection cooling performance is improved by 58.4-88.9%. The result comparison shows that the heat dissipation device of this invention has significantly better natural convection heat dissipation performance.

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Abstract

The invention relates to a high-performance heat sink based on a directional carbon nanotube thin film and a fabrication method of the heat sink. The heat sink comprises a directional carbon nanotube thin film (4) and a copper plate (5), wherein microgrooves (7) are cut in the copper plate, the directional carbon nanotube thin film (4) is laid on the copper plate (5) along a direction perpendicular to the directions of the microgrooves (7), and the directional carbon nanotube thin film (4) is in close contact with top ends of side walls of the microgrooves (7). Under the same heating power condition, the heat sink has relatively obvious low balancing temperature compared with a general pure copper heat sink.

Description

technical field [0001] The invention relates to the development of a radiator based on an aligned carbon nanotube film. The radiator has excellent natural convection heat dissipation performance and is especially suitable for the research, development and application of thermal functional devices. Background technique [0002] With the rapid development of integrated electronic devices, while their working efficiency is increasing, the energy consumed and the accompanying heat are also increasing rapidly. How to quickly and efficiently conduct and dissipate the heat generated by these instruments has become an important problem facing the rapid development of electronic equipment. Therefore, people are constantly trying to find more efficient heat conduction and heat dissipation materials. On the other hand, although people have designed and developed many effective heat dissipation performance solutions, such as forced convection radiators, thermoelectric coolers (G.Bulman...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20C01B31/02B82Y30/00B82Y40/00B23K26/38
CPCB23K26/38B82Y30/00B82Y40/00H05K7/2039
Inventor 张光姚伟
Owner CHINA ACADEMY OF SPACE TECHNOLOGY
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