Metal-coated resin particles and electroconductive adhesive in which same are used

Abstract

Provided are metal-coated resin particles that comprise resin particles and a metal coating layer that covers at least some of the resin particles, wherein it is possible to obtain a high-reliability electrical connection after repeated compression. There are used metal-coated resin particles that have an average grain diameter of 1-100[mu]m and exhibit a recovery of at least 90% after 30% compressive deformation, the metal coating layer comprising a metal having a Vickers hardness of 100 or less and an average thickness of 20-150 nm.

Description

technical field [0001] The present invention relates to metal-coated resin particles and a conductive adhesive using the same. Background technique [0002] As metal-coated resin particles compounded in conductive adhesives used for electrode connection of printed circuit boards, metal-coated resin particles in which resin particles containing acrylic resin are coated with precious metals such as gold via a nickel layer are often used. . [0003] For example, Patent Document 1 discloses that the K value at 10% compression deformation is 50 to 250 kgf / mm for the purpose of providing conductive microspheres having moderate compression deformation and deformation recovery, and excellent connection reliability. 2 The electroconductive microparticles|fine-particles which provided the electroconductive layer which consists of a nickel-gold plating layer on the surface of a microsphere with a recovery rate of 15-100% of high elastic modulus. [0004] In addition, Patent Document ...

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Problems solved by technology

[0010] However, even with these metal-coated resin particles, as the compression deformation is repeated, the adhesion between the resin particles and the metal decreases, and when used in a conductive adhesive, a highly reliable electrical connection cannot be obtained.

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