High-hydrostatic grinding equipment and grinding method

Abstract

The invention discloses high-hydrostatic grinding equipment suitable for conducting grinding machining on engineering ceramic and other hard and brittle materials. The high-hydrostatic grinding equipment comprises a grinding wheel frame system 1, a pressurization system 2, a vertical feed system 3, a horizontal feed system 4 and a box body 5; a cavity 501 is formed in the box body 5; the grinding wheel frame system 1 is located on the box body 5 and extends into the cavity 501; the vertical feed system 3 is located under the box body 5 and extends into the cavity 501; the pressurization system 2 is located on one side of the box body 5 and extends into the cavity 501; the horizontal feed system 4 is located on the other side of the box body 5 and extends into the cavity 501; and the box body 5 is further provided with an oil inlet hole 502 and an oil outlet hole 503. By means of the high-hydrostatic grinding equipment, a liquid high-pressure environment can be created, when a workpiece is put into the equipment to be machined, pressure in the three directions is applied to the workpiece at the same time, forming and expanding of machining cracks can be inhibited, and accordingly machining damage to the material is reduced.

Description

technical field [0001] The invention relates to equipment for low-loss grinding of hard and brittle materials such as ceramics, in particular to a high hydrostatic grinding equipment. Background technique [0002] For hard, brittle and difficult-to-machine materials such as ceramics and optical glass, grinding with diamond grinding wheels is a common processing method. However, due to its brittleness and hardness, machining cracks are easily formed during machining, which can cause surface and subsurface crack damage and reduce the stability and reliability of the workpiece. In order to remove the surface and sub-surface damage layer after grinding of hard and brittle materials such as ceramics, it is often necessary to use diamond micropowder polishing, grinding and other methods for ultra-precision machining of the workpiece, resulting in long processing time and high processing costs, and the manufacturing cost almost accounts for 60%-80% of its total cost. In the grind...

AI Technical Summary

Problems solved by technology

However, in order to control the thickness of the undeformed cutting layer of a single abrasive particle below the critical value, ultra-fine diamond grinding wheels and very low grinding consumption are required, which greatly reduces the material removal efficiency

At present, for the grinding of hard and brittle materials such as ceramics, it is difficult to obtain high material removal rate and low surface and subsurface crack damage at the same time.

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