Semiconductor assembly pressure testing device and testing equipment

Abstract

The invention relates to a semiconductor assembly pressure testing device and testing equipment. The semiconductor assembly pressure testing device comprises a plurality of pressure testing units and a rotary plate unit. Each pressure testing unit comprises a support frame, an upper test base and a lower test base. The rotary plate unit comprises a pivot shaft, a rotary plate and a plurality of floating test bases, wherein each floating test base is connected with the rotary plate through a plurality of elastic pieces. The rotary plate rotates so as to impel each floating test base to be located between an upper test base and a lower test base correspondingly. The lower test base comprises a heating device and a heat conducting plate which are fixedly arranged on the lower test base. Each pressure testing unit supplies different test pressure and temperature so as to continuously test each semiconductor assembly in different temperature and pressure environments. Therefore, the semiconductor assembly testing device can be provided for a semiconductor assembly to be tested to be continuously transported and tested among a plurality of pressure testing units, thereby significantly improving the test capacity.

Description

technical field [0001] The invention relates to a semiconductor component pressure testing device and testing equipment thereof, in particular to a testing device and testing equipment suitable for testing the pressure sensing characteristics of a semiconductor component. Background technique [0002] Known technologies such as the semiconductor component stress testing device disclosed in U.S. Patent Publication No. 2009 / 0015277 A1, please refer to Figure 8 , is a side view of a known semiconductor component stress testing device. As shown in the figure, the pressure testing device described herein includes a first half cavity 91 and a second half cavity 92, wherein the first half cavity 91 is a fixed end, and the second half cavity 92 is lifted by a The device 90 moves vertically up and down to seal or separate the pressure testing device. The first half-cavity 91 has a lower groove 95 for carrying a carrier plate 97 on which a semiconductor component 96 is installed. T...

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Problems solved by technology

However, this design can only test a single pressure chamber at a time during the pressure test. In addition, the case uses a quick connection and clip method, resulting in a high gas leakage rate and a relatively low production capacity.

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