Method for producing single PCS substrate by UV laser cutting

Abstract

The invention relates to a method for producing a single PCS substrate by UV laser cutting. The method comprises the following steps: (1) selecting a specific fixture board basal plate; (2) drilling a first hole and a second hole in the fixture board basal plate; (3) performing primary depth-controlled milling in the fixture board basal plate to obtain a first milling groove; (4) performing secondary depth-controlled milling in the fixture board basal plate to obtain a second milling groove; (5) milling the periphery of the fixture board basal plate to obtain a fixture board finished product; (6) fixing a cut substrate on the fixture board, and positioning a single PCS substrate in the first milling groove and the second milling groove; (7) correcting the energy of UV laser equipment to position a cut substrate; and (8) performing UV laser treatment on the cut substrate to obtain a single PCS substrate, taking the substrate and placing. By adopting the method, the equipment utilization rate can be improved, the capacity and quality can be improved, and the cost can be reduced.

Description

technical field [0001] The invention relates to a production method of a substrate, in particular to a production method of cutting a single PCS substrate by UV laser. Background technique [0002] UV laser cutting is used for precise cutting of flexible circuit boards and organic cover films. The existing production method of UV laser cutting into single PCS has the following disadvantages: [0003] (1) After the cutting is completed, the substrate is scattered on the machine table and is not easy to take, which has hidden dangers to the production quality and low production efficiency; [0004] (2) If the laser energy setting is too high, the finger is easy to oxidize, and if the energy is too low, the single PCS connecting rib is not easy to fall; the waste generated by the connecting rib not easy to fall will affect the production quality, and the production efficiency is low during the post-processing operation; [0005] (3) There are too many equipment suctions in the...

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Problems solved by technology

[0003] (1) After the cutting is completed, the substrate is scattered on the machine table and is not easy to take, which has hidden dangers to the production quality and low production efficiency;

[0004] (2) If the laser energy setting is too high, the finger is easy to oxidize, and if the energy is too low, the single PCS connecting rib is not easy to fall; the waste generated by the connecting rib not easy to fall will affect the production quality, and the production efficiency is low during the post-processing operation;

[0005] (3) There are too many equipment suctions in the hollowed-out area of ​​the substrate, which is prone to offset during the cutting process, which increases manual re-inspection, increases production costs and cannot guarantee product quality, affecting normal delivery

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