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Thickening method for metalized layer of LTCC substrate

A metallized layer and substrate technology, applied in the field of microelectronics, can solve the problems of unfavorable sintering, delamination, cracking and other problems of the film layer, and achieve the effect of uniform thickness, uniform film thickness and reduction of printing times.

Inactive Publication Date: 2017-02-01
NO 43 INST OF CHINA ELECTRONICS TECH GRP CETC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Too thick film is not conducive to sintering, and it is prone to delamination, cracking and other film defects

Method used

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  • Thickening method for metalized layer of LTCC substrate
  • Thickening method for metalized layer of LTCC substrate
  • Thickening method for metalized layer of LTCC substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] When there is no ground hole in the printed large-area conductive film layer, the surface of the LTCC substrate body 1 is preset to print the screen 3, and then the conductive paste 4 is printed to form a large-area conductive film layer, and the printed screen 3 is close to the LTCC substrate body 1. There are uniform parallel lines in the middle and around the sides on one side. The parallel lines are parallel and regularly arranged. The line width is 0.1 mm, and the line spacing is 1 mm; 23 μm, the latex thickness is 30 μm, the thickness of the middle area of ​​the large-area conductor film layer obtained by printing once is increased by more than 60%, and the overall uniformity of the conductor is better.

Embodiment 2

[0029] When there is no ground hole in the printed large-area conductive film layer, the surface of the LTCC substrate body 1 is preset to print the screen 3, and then the conductive paste 4 is printed to form a large-area conductive film layer, and the printed screen 3 is close to the LTCC substrate body 1. There are uniform parallel lines in the middle and around the sides on one side, and the parallel lines are parallel and regularly arranged. The line width is 0.15 mm, and the line spacing is 3 mm; 23 μm, latex thickness is 30 μm, the thickness of the middle area of ​​the large-area conductor film layer obtained by printing once is increased by more than half, the overall uniformity of the conductor is better, and the increased support latex area accounts for about 5% of the total support area.

Embodiment 3

[0031]When there is no ground hole in the printed large-area conductive film layer, the surface of the LTCC substrate body 1 is preset to print the screen 3, and then the conductive paste 4 is printed to form a large-area conductive film layer, and the printed screen 3 is close to the LTCC substrate body 1. There are uniform parallel lines in the middle and around the sides on one side. The parallel lines are parallel and regularly arranged. The line width is 0.2 mm, and the line spacing is 4 mm; 23 μm, the latex thickness is 30 μm, the thickness of the middle area of ​​the large-area conductor film layer obtained by printing once is increased by more than one-third, and the overall uniformity of the conductor is better.

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Abstract

The invention discloses a thickening method for a metalized layer of an LTCC substrate. A printing screen is preset at the surface of an LTCC substrate body, a conductor slurry is printed to form a large-area conductor film layer, and supports are distributed between the printing screen and the LTCC substrate body uniformly. The printed large-area conductor film layer is thickened, the printing screen with supports by thin lines is added to a large-area conductor, and the thickness of the printed large-area conductor film layer is improved greatly compared with that of a common large-area conductor; and the thickness of the printed large-area conductor film layer is uniform, and uniform and parallel thin lines are added to the large-area conductor, the thickness of the edge of the printed large-area conductor film layer is similar to that of the middle portion of the same, and the phenomenon that the common large-area conductor is thick in the edge but thin in the middle at present is avoided.

Description

technical field [0001] The invention belongs to the technical field of microelectronics, and in particular relates to a method for increasing the thickness of a metallization layer on an LTCC substrate. Background technique [0002] Low temperature co-fired ceramics (LTCC) for multilayer circuit wiring are increasingly used for miniaturization and high-density integration of modules or systems. LTCC substrates have good high-frequency characteristics, and have unique advantages as substrates for transceiver components in microwave / radio frequency areas such as radar and communications. In use, LTCC ceramic substrates are often welded to heat sinks or metal shells (both called metal bottom plates). The welding of the LTCC substrate and the metal base plate is generally to sinter a layer of weldable thick film metallization layer (conductor welding layer) on the surface of the substrate. The quality of the metallized soldering layer of the LTCC substrate often affects the so...

Claims

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Application Information

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IPC IPC(8): H01L21/48
CPCH01L21/4821
Inventor 李建辉王伟李章林王青肖金华
Owner NO 43 INST OF CHINA ELECTRONICS TECH GRP CETC
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